Display device and wiring structure
According to one embodiment, a display device includes a first substrate including a semiconductor layer, a first inorganic insulating film provided above the semiconductor layer and including a first opening, an organic insulating film provided above the semiconductor layer and including a second opening in a region which overlaps the first opening, a metal film stacked on the semiconductor layer and a pixel electrode provided in the first opening and the second opening to be in contact with the metal film and the semiconductor layer, and the metal film is spaced from a first side surface of the first opening and a second side surface of the second opening.
1. A display device comprising:
a first substrate comprising: a semiconductor layer; a first inorganic insulating film provided above the semiconductor layer and comprising a first opening in a region which overlaps the semiconductor layer; an organic insulating film provided above the semiconductor layer and comprising a second opening in a region which overlaps the first opening; a metal film stacked on the semiconductor layer on an inner side of the region where the second opening is formed; and a pixel electrode provided in the first opening and the second opening to be in contact with the metal film and the semiconductor layer,
the metal film being spaced from a first side surface of the first opening and a second side surface of the second opening.
2. The display device of claim 1 , further comprising:
a second inorganic insulating film provided between the semiconductor layer and the organic insulating film,
wherein
the organic insulating film is provided between the semiconductor layer and the first inorganic insulating film, and
the second inorganic insulating film comprises a third opening in a region which overlaps the first opening and the second opening.
3. The display device of claim 2 , wherein
the metallic film is spaced from a third side surface of the third opening.
4. The display device of claim 3 , wherein
the pixel electrode is in contact with the semiconductor layer between the third side surface and the metal film.
5. The display device of claim 2 , wherein
the first inorganic insulating film covers the second side surface and is in contact with the second inorganic insulating film in the second opening.
6. The display device of claim 1 , wherein
the first inorganic insulating film is provided between the semiconductor layer and the organic insulating film, and
the pixel electrode covers the second side surface and is in contact with the first inorganic insulating film in the second opening.
7. The display device of claim 6 , wherein
the pixel electrode covers the first side surface and is in contact with the semiconductor layer between the first side surface and the metal film.
8. The display device of claim 1 , wherein
at least one end portion of the metal film is in contact with a fourth side surface of the first opening.
9. The display device of claim 2 , further comprising:
a first wiring portion and a second wiring portion disposed on the second inorganic insulating film and covered by the organic insulating film,
wherein
the first opening, the second opening and the third opening are located between the first wiring portion and the second wiring portion in plan view.
10. The display device of claim 6 , further comprising:
a first wiring portion and a second wiring portion disposed on the first inorganic insulating film and covered by the organic insulating film,
wherein
the first opening and the second opening are located between the first wiring portion and the second wiring portion in plan view.
11. The display devices of claim 9 , wherein
the first wiring portion and the second wiring portion are formed from a same material as that of the metal film.
12. The display device of claim 9 , wherein
a width of the metal film is equal to or less than that of the first wiring portion and the second wiring portion.
13. The display device of claim 1 , further comprising:
a second substrate opposing the first substrate; and
a liquid crystal layer between the first substrate and the second substrate.
14. A wiring substrate comprising:
a semiconductor layer;
a first inorganic insulating film provided above the semiconductor layer and comprising a first opening in a region which overlaps the semiconductor layer;
an organic insulating film provided above the semiconductor layer and comprising a second opening in a region which overlaps the first opening;
a first conductive layer stacked on the semiconductor layer on an inner side of the region where the second opening is formed; and
a second conductive layer formed in the first opening and the second opening to be in contact with the first conductive layer and the semiconductor layer,
the first conductive layer being spaced from a first side surface of the first opening and a second side surface of the second opening, and
the second conductive layer being in contact with the semiconductor layer between the first side surface and the first conductive layer.
15. The wiring substrate of claim 14 , wherein
at least one end portion of the first conductive layer is in contact with a fourth side surface of the first opening.