Method for producing an optoelectronic device, and an optoelectronic device produced by the method
View Patent ↗In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.
1. A method for producing an optoelectronic device, the method comprising in the following order:
providing a substrate, having a first state having a non-planar shape,
reshaping the substrate into a second state by fixing the substrate in the second state by a releasable mechanical connection comprising at least one clamp,
wherein the at least one clamp comprises a shape memory material,
wherein the second state has a planar or substantially planar shape,
forming at least one optoelectronic component on the substrate,
reshaping the substrate into a third state,
wherein the third state is identical or substantially identical to the first state.
2. The method of claim 1 ,
wherein the non-planar shape comprises at least one curvature or one bend.
3. The method of claim 1 ,
wherein the substrate comprises a second shape memory material.
4. The method of claim 3 ,
wherein the second shape memory material comprises a metallic alloy or at least one polymer.
5. The method of claim 3 ,
wherein reshaping the substrate from the first state into the second state comprises a phase transition of the second shape memory material.
6. The method of claim 1 ,
wherein, in the process of providing the substrate, the substrate is formed in a non-planar fashion.
7. The method of claim 1 ,
wherein, in the process of providing the substrate, the substrate is formed in a planar fashion and is brought to the non-planar shape.
8. The method of claim 7 ,
wherein, in the process of providing the substrate, the substrate is formed in a planar fashion and is brought to the non-planar shape by a shape embossing.
9. The method of claim 3 ,
wherein reshaping the substrate from the first state into the second state comprises a fixing in the second state by at least one property of the second shape memory material.
10. The method of claim 1 ,
wherein forming at least one optoelectronic component on the substrate comprises a lamination of the at least one optoelectronic component on the substrate.
11. The method of claim 1 , further comprising:
at least forming a first electrode on the substrate, forming an organic functional layer stack on the first electrode and forming a second electrode on the organic functional layer stack.
12. The method of claim 3 ,
wherein reshaping the substrate from the second state into the third state comprises at least one of releasing the releasable, mechanical connection or a further phase transition of the second shape memory material.
13. The method of claim 1 ,
wherein reshaping the substrate from the second state into the third state comprises reshaping the at least one clamp.
14. The method of claim 1 , further comprising:
after forming the at least one optoelectronic component on the substrate: forming an encapsulation layer, wherein forming the encapsulation layer and reshaping the substrate in the third state are carried out simultaneously.
15. The method of claim 1 ,
wherein the non-planar shape is a convexly curved shape.