MULTI-STEP MOLDING PROCESS FOR ELECTRONIC DEVICE CHASSIS
An electronic device chassis is manufactured with a multi-step molding process. The process includes at least two separate injection molding steps. During the first step, an electronic component is placed in a first mold, and a first material is injected into the first mold to create a first chassis that surrounds part of the electronic component. In the second step, the first chassis is placed in a second mold, and a second material is injected into the second mold to create a second chassis that surrounds part of the first chassis. The second step can be performed at a higher pressure than the first step, which can produce a smoother exterior surface. Furthermore, the first chassis shields the electronic component from the higher pressure of the second step, which reduces the likelihood of damage to the electronic component.
1 . A method comprising:
placing an electronic component in a first mold, the electronic component including at least one conductive trace;
injecting a first material into the first mold to form a first chassis responsive to placing the electronic component in the first mode, the first chassis at least partially surrounding the electronic component to provide support for the electronic component;
placing the first chassis in a second mold responsive to injecting the first material into the first mold; and
injecting a second material into the second mold to form a second chassis responsive to placing the first chassis in the second mold, the second chassis at least partially surrounding the first chassis.
2 . The method of claim 1 , wherein the first material and the second material are the same material.
3 . The method of claim 1 , wherein the first material is selected from a group of materials consisting of polyamide, polyurethane, and polystyrene.
4 . The method of claim 1 , wherein the second material is selected from a group of materials consisting of acrylonitrile butadiene styrene (ABS) plastic, polycarbonate/ABS alloy, nylon, and polypropylene.
5 . The method of claim 1 , wherein the first material is injected at a pressure lower than a pressure at which the second material is injected.
6 . The method of claim 1 , wherein the first material is injected at a temperature lower than a temperature at which the second material is injected.
7 . The method of claim 1 , further comprising:
before injecting the first material into the first mold, placing a secondary component in the first mold.
8 . The method of claim 7 , wherein the first chassis at least partially surrounds the secondary component to provide support for the secondary component.
9 . The method of claim 8 , wherein the secondary component is a mechanical connector.
10 . The method of claim 1 , wherein the first chassis includes a first cutout, and the second chassis includes a second cutout, the first cutout and the second cutout aligning to expose a portion of the electronic component.
11 . The method of claim 10 , wherein the exposed portion of the electronic component contains a conducting terminal for transferring data between the electronic component and another electronic component.
12 . The method of claim 1 , wherein the electronic component is a flexible printed circuit board (PCB), the flexible PCB comprising a sheet of flexible material and at least one conductive trace printed on the sheet of flexible material.
13 . The method of claim 1 , wherein the electronic component is a reinforced flexible printed circuit board (PCB), the reinforced flexible PCB comprising a flexible PCB and a support structure at least partially encasing the flexible PCB, the flexible PCB comprising a sheet of flexible material and at least one conductive trace printed on the sheet of flexible material.
14 . The method of claim 1 , wherein the electronic component is a stamped lead frame.
15 . An electronic device manufactured by a process comprising:
placing an electronic component in a first mold, the electronic component including at least one conductive trace;
injecting a first material into the first mold to form a first chassis responsive to placing the electronic component in the first mode, the first chassis at least partially surrounding the electronic component to provide support for the electronic component;
placing the first chassis in a second mold responsive to injecting the first material into the first mold; and
injecting a second material into the second mold to form a second chassis responsive to placing the first chassis in the second mold, the second chassis at least partially surrounding the first chassis.
16 . The electronic device of claim 15 , wherein the first chassis includes a first cutout, and the second chassis includes a second cutout, the first cutout and the second cutout aligning to expose a portion of the electronic component.
17 . The electronic device of claim 16 , wherein the exposed portion of the electronic component contains a conducting terminal for transferring data between the electronic component and another electronic component.
18 . A method comprising:
connecting a first connecting surface of a first modular circuit to a second connecting surface of a second modular circuit using a wire bonding machine to obtain an electronic assembly;
placing the electronic assembly in a first mold;
injecting a first material into the first mold to form a first chassis responsive to placing the electronic assembly in the first mold, the first chassis at least partially surrounding the assembly to provide support for the electronic assembly;
placing the first chassis in a second mold responsive to injecting the first material into the first mold; and
injecting a second material into the second mold to form a second chassis responsive to placing the first chassis in the second mold, the second chassis at least partially surrounding the first chassis.
19 . The method of claim 18 , wherein connecting the first connecting surface to the second connecting surface comprises attaching a first end of a conductive wire to the first connecting surface and attaching a second end of the conductive wire to the second connecting surface.
20 . The method of claim 19 , wherein the conductive wire has a diameter of less than 300 microns.