IP Library Granted Patent US 10,522,726
Granted Patent B2
US 10,522,726 · App. 15/793,088 · Granted Dec 31, 2019

Display device

Inventor: Noritaka Tanabe (Osaka, JP)
Assignee: FUNAI ELECTRIC CO., LTD.
H01L33/60G02B6/0045G02F1/133553G02F1/133603H01L33/46H01L33/54H05B33/04H05B33/10H01L33/22H01L33/508
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Quick Facts
Patent No.
US 10,522,726
App. No.
15/793,088
Granted
Dec 31, 2019
Kind
B2
Abstract

A display device includes a display and at least one light source. The display displays image. The at least one light source emits light to the display. The at least one light source includes a semiconductor element with a substrate, a translucent sealing resin that covers the semiconductor element, and a reflective layer that is disposed on an upper face of the sealing resin.

Claims (61)

1. A display device comprising:

a display that displays image; and

at least one light source that emits light to the display, the at least one light source including

a semiconductor element with a substrate,

a translucent sealing resin that covers the semiconductor element, the sealing resin having an outer periphery that surrounds the sealing resin and forms an outer periphery of the at least one light source, an entirety of the outer periphery of the sealing resin exposing outside of the at least one light source, and

a reflective layer that is disposed on an upper face of the sealing resin to cover an entirety of the upper face of the sealing resin.

2. The display device according to claim 1 , wherein

the reflective layer has an outer periphery that is disposed further outside than an outer periphery of the semiconductor element as viewed in a direction perpendicular to an upper face of the at least one light source.

3. The display device according to claim 1 , wherein

the substrate is disposed at a top of the semiconductor element, and

an upper face of the substrate and a lower face of the reflective layer are separated by the sealing resin.

4. The display device according to claim 1 , wherein

the at least one light source further includes a phosphor layer that is disposed between the sealing resin and the semiconductor element,

the phosphor layer being disposed on side faces of the semiconductor element, and overlapping the reflective layer as viewed in a direction perpendicular to an upper face of the at least one light source, and

the sealing resin and an upper face of the semiconductor element closely contact with each other.

5. The display device according to claim 4 , wherein

the sealing resin entirely covers the semiconductor element and the phosphor layer.

6. The display device according to claim 1 , wherein

the sealing resin and side faces of the semiconductor element closely contact with each other.

7. The display device according to claim 1 , wherein

the reflective layer is formed substantially flat.

8. The display device according to claim 1 , wherein

the substrate is made of a sapphire substrate, and

the semiconductor element includes the sapphire substrate, a first conductivity type GaN layer, a light emitting layer and a second conductivity type GaN layer that are arranged in this order starting from an upper face side of the sealing resin.

9. The display device according to claim 1 , further comprising

a reflective sheet that reflects light from the at least one light source, the reflective sheet including a bottom face that is arranged substantially parallel to a display face of the display,

the at least one light source being disposed at a location closer to the display than the bottom face in a direction substantially perpendicular to the display face of the display.

10. The display device according to claim 1 , wherein

the at least one light source includes a plurality of light sources.

11. The display device according to claim 10 , wherein

the light sources are arranged along a horizontal line on a plane substantially parallel to a display face of the display.

12. The display device according to claim 10 , wherein

the light sources are arranged along a vertical line on a plane substantially parallel to a display face of the display.

13. The display device according to claim 10 , wherein

the light sources are arranged in a plurality of lines.

14. The display device according to claim 1 , wherein

the reflective layer has an outer periphery that substantially overlaps with an outer periphery of the sealing resin as viewed in a direction perpendicular to an upper face of the at least one light source.

15. The display device according to claim 1 , wherein

the reflective layer has an upper face that forms an uppermost face of the at least one light source.

16. The display device according to claim 1 , wherein

the substrate has an uneven upper face.

17. A display device comprising:

a display that displays image; and

at least one light source that emits light to the display, the at least one light source including

a semiconductor element with a substrate,

a translucent sealing resin that covers the semiconductor element, the sealing resin having an outer periphery that surrounds the sealing resin and forms an outer periphery of the at least one light source, an entirety of the outer periphery of the sealing resin exposing outside of the at least one light source, and

a reflective layer that is disposed on an upper face of the sealing resin,

the reflective layer including a specific pattern that transmits part of the light from the semiconductor element, and

the specific pattern of the reflective layer having a lattice-shape or a shape in which rectangles are arranged in a specific direction.

18. The display device according to claim 17 , wherein

the upper face of the sealing resin exposes outside through a gap in the reflective layer.

19. A display device comprising:

a display that displays image; and

at least one light source that emits light to the display, the at least one light source including

a semiconductor element with a substrate,

a translucent sealing resin that covers the semiconductor element,

a reflective layer that is disposed on an upper face of the sealing resin, and

a phosphor layer that is disposed between the sealing resin and the semiconductor element,

the phosphor layer being disposed on side faces of the semiconductor element, and overlapping the reflective layer as viewed in a direction perpendicular to an upper face of the at least one light source,

the sealing resin and an upper face of the semiconductor element closely contact with each other, and

the phosphor layer being arranged to entirely surround an outer periphery of the semiconductor element that is defined by the side faces of the semiconductor element.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2025
From: FUNAI GROUP CO., LTD
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 073121/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2025
From: FUNAI ELECTRIC CO., LTD. (F/K/A FE-TECH CO., LTD.)
To: FEC IP LLC
Reel/Frame 073121/0883 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2017
From: TANABE, NORITAKA
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 043945/0027 →
Priority Claims (1)
JP 2016-210490 · Oct 27, 2016 · national
Continuity (1)
Related Publication 20180123004A1 · May 3, 2018