IP Library Granted Patent US 10,551,268
Granted Patent B2
US 10,551,268 · App. 15/793,179 · Granted Feb 4, 2020

Pressure sensor with lengthily disposed substrate

Inventor: GonJae Lee (Yongin-si, KR)
Assignee: MANDO CORPORATION
G01L19/0627G01L5/0085G01L19/0084G01L19/147H01L2224/48091H01L2224/48137H01L2224/73265
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Quick Facts
Patent No.
US 10,551,268
App. No.
15/793,179
Granted
Feb 4, 2020
Kind
B2
Abstract

The embodiments relate to a pressure sensor comprising: a sensor module which is sensing pressure; a first supporter coupled to an upper portion of the sensor module, having a substrate 231 , lengthily disposed therein in an axial direction, and thus electrically connected to the sensor module; and a second supporter to which the substrate is couple while brought into contact with a spring electrode, the second supporter being coupled to an upper portion of the first supporter and having a spring groove in which a lower end portion of spring electrode lengthily disposed in an axial direction is stably placed.

Claims (18)

1. A pressure sensor comprising:

a sensor module configured to sense pressure;

a first supporter coupled to an upper portion of the sensor module and having a substrate disposed therein, the substrate being lengthily disposed in an axial direction to be electrically connected to the sensor module; and

a second supporter to which the substrate is couple while being brought into contact with a spring electrode, the second supporter being coupled to an upper portion of the first supporter and having a spring groove formed therein such that a lower end portion of the spring electrode lengthily disposed in an axial direction is stably placed in the spring groove.

2. The pressure sensor of claim 1 , wherein the substrate is coupled to the second supporter while pressing an outer circumferential surface of the spring electrode and is brought into contact with the outer circumferential surface of the spring electrode to be electrically connected thereto.

3. The pressure sensor of claim 2 , wherein the spring electrode comprises a diameter-increased portion convexly formed at a portion thereof contacting the substrate by increasing the outer diameter of the spring electrode.

4. The pressure sensor of claim 3 , wherein contact grooves are formed to be recessed in a round shape on both side surfaces of the substrate, and the diameter-increased portion of the spring electrode is brought into tight contact with the contact grooves.

5. The pressure sensor of claim 1 , wherein the second supporter has an insertion groove formed on a lower portion thereof so that an upper portion of the substrate is inserted and coupled therein, and the insertion groove communicates with the spring groove.

6. The pressure sensor of claim 1 , wherein a coupling surface facing the one side surface of the substrate is formed at the first supporter and the substrate is lengthily disposed at the first supporter in an axial direction while being coupled to the coupling surface.

7. The pressure sensor of claim 1 , wherein the sensor module comprises a sensor protrusion protruding upward and having a long flat surface portion formed in an axial direction so as to be parallel to the substrate, and a sensing element is disposed on the flat surface portion to measure a pressure of the sensor module.

8. The pressure sensor of claim 7 , wherein the substrate is connected to the sensing element by an electric wire.

9. The pressure sensor of claim 1 , further comprising an electrode member comprising: a spring contact portion which is stably placed in the spring groove and is in contact with the spring electrode; and a substrate contact portion which is bent from the spring contact portion, is stably placed in the insertion groove, and is brought into contact with the substrate, so that the electrode member electrically connects the spring electrode and the substrate.

10. The pressure sensor of claim 9 , wherein the substrate contact portion comprises an elastic deforming portion, which convexly protrudes to the outside of the insertion groove and is thus in tight contact with and supported by the insertion groove when the substrate is inserted into the insertion groove.

11. The pressure sensor of claim 10 , wherein the substrate contact portion comprises a support end portion, which extends and is bent from the end of the elastic deforming portion and is supported on an outer side surface of the second supporter.

12. The pressure sensor of claim 9 , wherein a first seating groove, to which the spring contact portion is coupled, is formed in the spring groove.

13. The pressure sensor of claim 9 , wherein a second seating groove, to which the substrate contact portion is coupled, is formed in the insertion groove.

14. The pressure sensor of claim 1 , further comprising an electrode member, which is configured to electrically connect the spring electrode and the substrate, wherein the electrode member comprises: a spring contact portion, which is stably placed in the spring groove and is brought into contact with the spring electrode; and a substrate contact portion, which is bent in a direction surrounding an outer circumferential surface of the spring electrode from the spring contact portion and is in tight contact with the substrate while being elastically deformed when the substrate is inserted therein.

15. The pressure sensor of claim 1 , wherein the substrate of the first supporter is a single substrate being lengthily disposed in the axial direction of the pressure sensor to be electrically connected to the sensor module.

Assignments (2)
CHANGE OF NAME Recorded Dec 23, 2022
From: MANDO CORPORATION
To: HL MANDO CORPORATION
Reel/Frame 062214/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2017
From: LEE, GONJAE
To: MANDO CORPORATION
Reel/Frame 044616/0595 →
Priority Claims (1)
KR 10-2016-0139881 · Oct 26, 2016 · national
Continuity (1)
Related Publication 20180113044A1 · Apr 26, 2018