Interference filter for wireless power transfer systems

1. An EMI shield for a wireless power transmitter, comprising:

a shield layer that, when positioned over a transmitting coil of the wireless power transmitter, capacitively couples to the transmitting coil to capture electromagnetic radiation while allowing magnetic power to pass,

wherein the shield layer is a patterned metallic layer formed on a substrate, the patterned metallic layer having a plurality of holes formed in a metallic layer, the metallic layer being coupled to ground.

2. The EMI shield of claim 1 , wherein the patterned metallic layer is a grid of overlapping wires that are connected at their intersections.

3. The EMI shield of claim 1 , wherein another end opposite the one end that is grounded of each of the first open end traces are coupled by capacitors.

4. The EMI shield of claim 1 , wherein the plurality of holes of the patterned metallic layer includes a hole pattern positioned such as to not support eddy currents formed by the magnetic power.

5. The EMI shield of claim 4 , wherein the hole pattern forms a decorative pattern.

6. An EMI shield for a wireless power transmitter, comprising:

a shield layer that, when positioned over a transmitting coil of the wireless power transmitter, capacitively couples to the transmitting coil to capture electromagnetic radiation while allowing magnetic power to pass,

wherein the shield layer is a patterned metallic layer formed on a substrate, the patterned metallic layer having open ended traces formed in the patterned metallic layer, and

wherein the patterned metallic layer includes a plurality of first open ended traces grounded with a ground strap clamped across the plurality of first open ended traces and configured to ground one end of each of the first open ended traces.

7. The EMI shield of claim 6 , further including a plurality of second open ended traces separated from the plurality of first open ended traces in a non-overlapping fashion and wherein the ground strap is configured to ground one end of the second open ended traces.

8. The EMI shield of claim 6 , wherein the substrate is a printed circuit board.

9. The EMI shield of claim 6 , wherein the substrate is a plastic sheet.

10. A method of providing a shield for a wireless power transmitter, comprising:

covering a wireless power coil with a patterned metallic layer that capacitively couples to the wireless power coil while passing magnetic power from the wireless power coil; and

grounding the patterned metallic layer,

wherein the patterned metallic layer is formed on a substrate, and

wherein the patterned metallic layer has a plurality of holes formed in a metallic layer, the metallic layer being coupled to ground.

11. The method of claim 10 , wherein the plurality of holes formed in the patterned metallic layer are positioned such that eddy currents are not formed in the metallic layer by the magnetic power output of the wireless power coil.

12. The method of claim 10 , wherein the substrate is a printed circuit board.

13. The method of claim 10 wherein the substrate is a plastic sheet.

14. The method of claim 10 wherein the plurality of holes of the patterned metallic layer includes a hole pattern positioned such as to not support eddy currents formed by the magnetic power.

15. The method of claim 14 , wherein the hole pattern forms a decorative pattern.

16. A method of providing a shield for a wireless power transmitter, comprising:

covering a wireless power coil with a patterned metallic layer that capacitively couples to the wireless power coil while passing magnetic power from the wireless power coil; and

grounding the patterned metallic layer,

wherein the patterned metallic layer is formed on a substrate, the patterned metallic layer having open ended traces formed in the patterned metallic layer, and

wherein the patterned metallic layer includes a plurality of first open ended traces grounded with a ground strap clamped across the plurality of first open ended traces and configured to ground one end of each of the first open ended traces.

17. The method of claim 16 , wherein the patterned conductor includes wire traces positioned on a substrate where the ends of the wired traces are coupled by capacitors.

18. The method of claim 16 , wherein the patterned metallic layer further includes a plurality of second open ended traces separated from the plurality of first open ended traces in a non-overlapping fashion and wherein the ground strap is further configured to ground one end of the second open ended traces.

19. The method of claim 16 , wherein the substrate is a printed circuit board.

20. The method of claim 16 , wherein the substrate is a plastic sheet.