Pressure sensor with testing device and related methods

1. A testing device comprising:

a probe chuck configured to apply pressure to a support body of a pressure sensor under test, the pressure sensor under test positioned within a structure and comprising:

a pressure sensor integrated circuit (IC) comprising a pressure sensor circuit responsive to bending, and

a transceiver circuit coupled to the pressure sensor circuit, wherein the support body of the pressure sensor under test has a recess coupled to the pressure sensor IC; and

a wireless card configured to apply pressure to the pressure sensor IC of the pressure sensor under test, and to generate radio frequency (RF) energy to activate the pressure sensor under test.

2. The testing device of claim 1 , wherein the pressure sensor under test is coupled between the wireless card and the probe chuck.

3. The testing device of claim 1 , wherein the probe chuck is configured to apply pressure to a plurality of pressure sensors under test.

4. The testing device of claim 3 , wherein the probe chuck comprises a base and a rigid substrate coupled with the base of the probe chuck, the rigid substrate configured to apply an upward force onto support bodies of the plurality of pressure sensors under test.

5. The testing device of claim 4 , wherein the probe chuck further comprises a load cell coupled between the base of the probe chuck and the rigid substrate of the probe chuck.

6. The testing device of claim 1 , wherein the wireless card comprises:

a rigid press configured to apply pressure to the pressure sensor IC of the pressure sensor under test, the rigid press comprising electrically conductive antenna traces configured to generate the RF energy to activate the pressure sensor under test; and

a base coupled to the rigid press and carrying the electrically conductive antenna traces.

7. The testing device of claim 6 , wherein the rigid press and the support body of the pressure sensor under test comprise the same material.

8. The testing device of claim 6 , wherein the rigid press has a curved surface.

9. The testing device of claim 1 , wherein the wireless card comprises:

a rigid press configured to apply pressure to the pressure sensor IC of the pressure sensor under test,

electrically conductive antenna traces configured to generate the RF energy to activate the pressure sensor under test; and

a substrate coupled to the rigid press and carrying the electrically conductive antenna traces.

10. The testing device of claim 9 , wherein the rigid press and the substrate are laterally spaced apart.

11. The testing device of claim 9 , wherein the rigid press and the substrate are integral.

12. The testing device of claim 11 , wherein the substrate comprises a multilayer structure of a ceramic material.

13. The testing device of claim 9 , wherein the substrate surrounds the rigid press.

14. The testing device of claim 1 , further comprising a deformable layer between the wireless card and the pressure sensor under test.

15. The testing device of claim 14 , wherein the deformable layer comprises a polyimide film, polytetrafluoroethylene (PTFE), a foil layer, or a paper layer.

16. The testing device of claim 1 , further comprising a curved layer between the wireless card and the pressure sensor under test.

17. The testing device of claim 1 , wherein the wireless card further comprises a load cell between a base of the wireless card and a rigid press of the wireless card, the load cell configured to measure a pressure exerted on the pressure sensor IC of the pressure sensor under test.

18. The testing device of claim 1 , further comprising a joint coupled to the wireless card and configured to position the wireless card adjacent the pressure sensor under test.

19. A method comprising:

applying pressure to a support body of a pressure sensor under test using a wireless card, the pressure sensor under test positioned within a structure and comprising a pressure sensor integrated circuit (IC) comprising a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit, wherein the support body of the pressure sensor under test has a recess coupled to the pressure sensor IC; and

generating radio frequency (RF) energy to activate the pressure sensor under test.

20. The method of claim 19 , further comprising:

applying pressure to a plurality of pressure sensors under test, wherein the plurality of pressure sensors under test comprises the pressure sensor under test; and

positioning the wireless card adjacent the pressure sensor under test by using a joint coupled to the wireless card.

21. The method of claim 19 , further comprising:

applying pressure to the pressure sensor IC of the pressure sensor under test using a rigid press; and

generating the RF energy using electrically conductive antenna traces of the wireless card.

22. The method of claim 21 , wherein the rigid press has a curved surface.

23. A method of testing a pressure sensor using a testing device that includes a probe chuck and a wireless card, the method comprising:

exerting a first pressure to a pressure sensor under test with the probe chuck of the testing device, the pressure sensor under test positioned within a structure and comprising a pressure sensor integrated circuit (IC) comprising a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit, wherein a support body of the pressure sensor under test has a recess coupled to the pressure sensor IC;

activating the pressure sensor under test by generating radio frequency (RF) energy with the wireless card of the testing device;

transmitting, by the pressure sensor under test, a detected pressure value;

receiving, by the testing device, the detected pressure value; and

comparing, by the testing device, the detected pressure value with the first pressure.

24. A testing device comprising:

means for applying pressure to a support body of a pressure sensor under test, the pressure sensor under test positioned within a structure and comprising:

a pressure sensor integrated circuit (IC) comprising a pressure sensor circuit responsive to bending, and

a transceiver circuit coupled to the pressure sensor circuit, wherein the support body of the pressure sensor under test has a recess coupled to the pressure sensor IC; and

means for generating radio frequency (RF) energy to activate the pressure sensor under test.