IP Library Granted Patent US 10,800,113
Granted Patent B2
US 10,800,113 · App. 15/798,923 · Granted Oct 13, 2020

Bonding for additively manufactured thermoplastic composite structures

Inventors: David E. Hauber (Troy, NY); Zachary A. August (Santa Clara, CA)
B29C70/382B33Y50/00B33Y10/00B33Y30/00
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Quick Facts
Patent No.
US 10,800,113
App. No.
15/798,923
Granted
Oct 13, 2020
Kind
B2
Abstract

Disclosed embodiments provide automated fiber placement techniques for fabrication of parts made from composite materials. Tape plies are wound around a mandrel while a polymer is dispensed on a tape ply shortly before compaction. A bead monitoring system monitors the size and placement of the bead on the tape ply and feeds back information to various process control systems to maintain an optimal bead size.

Claims (41)

1. A computer-implemented method for performing automated fiber placement, comprising:

dispensing a first ply over a mandrel;

dispensing a tape on the first ply;

dispensing a polymer material between the first ply and the dispensed tape, wherein the polymer material comprises a powdered polymer bead comprised of particles having a size ranging from 10 microns to 75 microns; and

compacting the dispensed tape onto the first ply, such that the polymer material width covers the width of the dispensed tape.

2. The method of claim 1 , further comprising:

substantially continuously monitoring the polymer material width; and

adjusting a process parameter to maintain a constant polymer material width.

3. The method of claim 1 , wherein continuously monitoring the polymer material width comprises acquiring multiple images of the bead with a video camera.

4. The method of claim 3 , further comprising performing an edge detection process on the multiple images to identify the polymer material width.

5. The method of claim 2 , wherein adjusting a process parameter comprises adjusting a polymer dispensing rate.

6. The method of claim 2 , wherein adjusting a process parameter comprises adjusting a tape speed.

7. The method of claim 2 , wherein adjusting a process parameter comprises adjusting a heat affected zone temperature.

8. The method of claim 2 , wherein adjusting a process parameter comprises adjusting a compaction pressure.

9. An apparatus comprising:

a tape dispensing system;

a heating system;

a polymer dispensing system;

a bead monitoring system;

a compaction system;

a processor;

a memory coupled to the processor, wherein the memory contains instructions, that when executed by the processor, perform the steps of:

dispensing a first ply over a mandrel;

dispensing a tape on the first ply;

dispensing a polymer material between the first ply and the dispensed tape, wherein the polymer material comprises a powdered polymer bead comprised of particles having a size ranging from 10 microns to 75 microns; and

compacting the dispensed tape onto the first ply, such that the polymer material width covers the width of the dispensed tape.

10. The apparatus of claim 9 , wherein the memory further contains instructions, that when executed by the processor, perform the steps of:

substantially continuously monitoring a polymer material width; and

adjusting a process parameter to maintain a constant polymer material width.

11. The apparatus of claim 9 , wherein the bead monitoring system comprises a computer vision system.

12. The apparatus of claim 9 , wherein the polymer dispensing system comprises a filament polymer dispensing system.

13. The apparatus of claim 9 , wherein the polymer dispensing system comprises a vibratory dispensing system.

14. The apparatus of claim 9 , wherein the polymer dispensing system comprises a molten dispensing system.

15. A computer program product embodied in a computer-readable medium, comprising instructions, that when executed by a processor, perform the steps of:

dispensing a first ply over a mandrel;

dispensing a tape on the first ply;

dispensing a polymer material between the first ply and the dispensed tape, wherein the polymer material comprises a powdered polymer bead comprised of particles having a size ranging from 10 microns to 75 microns; and

compacting the dispensed tape onto the first ply, such that the polymer material width covers the width of the dispensed tape.

16. The computer program product of claim 15 , further comprising instructions, that when executed by the processor, perform the steps of:

continuously monitoring the polymer material width; and

adjusting a process parameter to maintain a polymer material width.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2024
From: TRELLEBORG SEALING SOLUTIONS GERMANY GMBH
To: TRELLEBORG SEALING SOLUTIONS ALBANY, INC.
Reel/Frame 066309/0506 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2022
From: TRELLEBORG SEALING SOLUTIONS ALBANY, INC.
To: TRELLEBORG SEALING SOLUTIONS GERMANY GMBH
Reel/Frame 059832/0744 →
CHANGE OF NAME Recorded Jan 19, 2022
From: ADC ACQUISITION COMPANY
To: TRELLEBORG SEALING SOLUTIONS ALBANY, INC.
Reel/Frame 058767/0641 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2017
From: HAUBER, DAVID E.; AUGUST, ZACHARY A.
To: ADC ACQUISITION COMPANY
Reel/Frame 044917/0396 →
Continuity (2)
Provisional Application 62429822 · Dec 4, 2016
Related Publication 20180154591A1 · Jun 7, 2018
Cited By (1)
US 12,431,774