IP Library Granted Patent US 10,101,809
Granted Patent B2
US 10,101,809 · App. 15/799,621 · Granted Oct 16, 2018

Systems, articles, and methods for capacitive electromyography sensors

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,101,809
App. No.
15/799,621
Granted
Oct 16, 2018
Kind
B2
Abstract

Systems, articles, and methods for improved capacitive electromyography (“EMG”) sensors are described. The improved capacitive EMG sensors include one or more sensor electrode(s) that is/are coated with a protective barrier formed of a material that has a relative permittivity ε r of about 10 or more. The protective barrier shields the sensor electrode(s) from moisture, sweat, skin oils, etc. while advantageously contributing to a large capacitance between the sensor electrode(s) and the user's body. In this way, the improved capacitive EMG sensors provide enhanced robustness against variations in skin and/or environmental conditions. Such improved capacitive EMG sensors are particularly well-suited for use in wearable EMG devices that may be worn by a user for an extended period of time and/or under a variety of skin and/or environmental conditions. A wearable EMG device that provides a component of a human-electronics interface and incorporates such improved capacitive EMG sensors is described.

Claims (47)

1. A method of fabricating a differential capacitive electromyography (“EMG”) sensor, the method comprising:

forming at least a portion of at least one circuit on a first surface of a substrate;

forming a first sensor electrode on a second surface of the substrate, the second surface of the substrate opposite the first surface of the substrate across a thickness of the substrate, wherein the first sensor electrode comprises an electrically conductive plate;

forming at least one electrically conductive pathway that communicatively couples the first sensor electrode and the at least a portion of at least one circuit;

forming a second sensor electrode on the second surface of the substrate, wherein the second sensor electrode comprises an electrically conductive plate;

forming at least one electrically conductive pathway that communicatively couples the second sensor electrode and the at least a portion of at least one circuit;

coating the first sensor electrode with a dielectric layer comprising a dielectric material that has a relative permittivity of at least about 10; and

coating the second sensor electrode with the dielectric layer.

2. The method of claim 1 wherein coating the first sensor electrode with a dielectric layer includes coating the first sensor electrode with a ceramic material.

3. The method of claim 1 , further comprising:

forming a ground electrode on the second surface of the substrate, wherein the ground electrode comprises an electrically conductive plate; and

forming at least one electrically conductive pathway that communicatively couples the ground electrode and the at least a portion of at least one circuit.

4. The method of claim 3 wherein coating the first sensor electrode with a dielectric layer includes either selectively coating the first sensor electrode with the dielectric layer and not coating the ground electrode with the dielectric layer, or coating both the first sensor electrode and the ground electrode with the dielectric layer and forming a hole in the dielectric layer to expose the ground electrode.

5. The method of claim 1 wherein coating the first sensor electrode with a dielectric layer comprises:

depositing a layer of electrically conductive adhesive on the first sensor electrode; and

depositing the dielectric layer on the layer of electrically conductive adhesive, and wherein the electrically conductive adhesive is selected from the group consisting of electrically conductive epoxy and electrically conductive solder.

6. A method of fabricating a capacitive electromyography (“EMG”) sensor, the method comprising:

forming at least a portion of at least one circuit on a first surface of a substrate;

forming a first sensor electrode on a second surface of the substrate, the second surface of the substrate opposite the first surface of the substrate across a thickness of the substrate, wherein the first sensor electrode comprises an electrically conductive plate;

forming at least one electrically conductive pathway that communicatively couples the first sensor electrode and the at least a portion of at least one circuit;

forming a ground electrode on the second surface of the substrate, wherein the ground electrode comprises an electrically conductive plate;

forming at least one electrically conductive pathway that communicatively couples the ground electrode and the at least a portion of at least one circuit;

coating the first sensor electrode with a dielectric layer comprising a dielectric material that has a relative permittivity of at least about 10, wherein coating the first sensor electrode with the dielectric layer includes either selectively coating the first sensor electrode with the dielectric layer and not coating the ground electrode with the dielectric layer, or coating both the first sensor electrode and the ground electrode with the dielectric layer and forming a hole in the dielectric layer to expose the ground electrode.

7. The method of claim 6 wherein coating the first sensor electrode with a dielectric layer includes coating the first sensor electrode with a ceramic material.

8. The method of claim 6 wherein the capacitive EMG sensor is a differential capacitive EMG sensor, the method further comprising:

forming a second sensor electrode on the second surface of the substrate, wherein the second sensor electrode comprises an electrically conductive plate;

forming at least one electrically conductive pathway that communicatively couples the second sensor electrode and the at least a portion of at least one circuit; and

coating the second sensor electrode with the dielectric layer.

9. The method of claim 6 wherein coating the first sensor electrode with a dielectric layer comprises:

depositing a layer of electrically conductive adhesive on the first sensor electrode; and

depositing the dielectric layer on the layer of electrically conductive adhesive, and wherein the electrically conductive adhesive is selected from the group consisting of electrically conductive epoxy and electrically conductive solder.

10. A method of fabricating a capacitive electromyography (“EMG”) sensor, the method comprising:

forming at least a portion of at least one circuit on a first surface of a substrate;

forming a first sensor electrode on a second surface of the substrate, the second surface of the substrate opposite the first surface of the substrate across a thickness of the substrate, wherein the first sensor electrode comprises an electrically conductive plate;

forming at least one electrically conductive pathway that communicatively couples the first sensor electrode and the at least a portion of at least one circuit; and

coating the first sensor electrode with a dielectric layer comprising a dielectric material that has a relative permittivity of at least about 10, wherein coating the first sensor electrode with a dielectric layer comprises:

depositing a layer of electrically conductive adhesive on the first sensor electrode; and

depositing the dielectric layer on the layer of electrically conductive adhesive, and wherein the electrically conductive adhesive is selected from the group consisting of electrically conductive epoxy and electrically conductive solder.

11. The method of claim 10 wherein coating the first sensor electrode with a dielectric layer includes coating the first sensor electrode with a ceramic material.

12. The method of claim 10 wherein the capacitive EMG sensor is a differential capacitive EMG sensor, the method further comprising:

forming a second sensor electrode on the second surface of the substrate, wherein the second sensor electrode comprises an electrically conductive plate;

forming at least one electrically conductive pathway that communicatively couples the second sensor electrode and the at least a portion of at least one circuit; and

coating the second sensor electrode with the dielectric layer.

13. The method of claim 10 , further comprising:

forming a ground electrode on the second surface of the substrate, wherein the ground electrode comprises an electrically conductive plate; and

forming at least one electrically conductive pathway that communicatively couples the ground electrode and the at least a portion of at least one circuit.

14. The method of claim 13 wherein coating the first sensor electrode with a dielectric layer includes either selectively coating the first sensor electrode with the dielectric layer and not coating the ground electrode with the dielectric layer, or coating both the first sensor electrode and the ground electrode with the dielectric layer and forming a hole in the dielectric layer to expose the ground electrode.

Assignments (6)
CHANGE OF NAME Recorded May 26, 2022
From: FACEBOOK TECHNOLOGIES, LLC
To: META PLATFORMS TECHNOLOGIES, LLC
Reel/Frame 060199/0876 →
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA PREVIOUSLY RECORDED AT REEL: 051649 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Feb 10, 2020
From: CTRL-LABS CORPORATION
To: FACEBOOK TECHNOLOGIES, LLC
Reel/Frame 051867/0136 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2020
From: CTRL-LABS CORPORATION
To: FACEBOOK TECHNOLOGIES, INC.
Reel/Frame 051649/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2019
From: NORTH INC.
To: CTRL-LABS CORPORATION
Reel/Frame 049368/0634 →
CHANGE OF NAME Recorded May 30, 2019
From: THALMIC LABS INC.
To: NORTH INC.
Reel/Frame 049548/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2019
From: MORUN, CEZAR; LAKE, STEPHEN
To: THALMIC LABS INC.
Reel/Frame 049310/0300 →