Systems, articles, and methods for electromyography sensors
View Patent ↗Systems, articles, and methods for surface electromyography (“EMG”) sensors that combine elements from traditional capacitive and resistive EMG sensors are described. For example, capacitive EMG sensors that are adapted to resistively couple to a user's skin are described. Resistive coupling between a sensor electrode and the user's skin is galvanically isolated from the sensor circuitry by a discrete component capacitor included downstream from the sensor electrode. The combination of a resistively coupled electrode and a discrete component capacitor provides the respective benefits of traditional resistive and capacitive (respectively) EMG sensor designs while mitigating respective drawbacks of each approach. A wearable EMG device that provides a component of a human-electronics interface and incorporates such capacitive EMG sensors is also described.
1. A method of fabricating an electromyography (“EMG”) sensor, the method comprising:
forming a first sensor electrode on a first surface of a substrate, wherein forming a first sensor electrode on a first surface of a substrate includes depositing at least a first layer of a first electrically conductive material on the first surface of the substrate;
depositing an amplifier on a second surface of the substrate, the second surface opposite the first surface across a thickness of the substrate;
depositing a first capacitor on the second surface of the substrate;
depositing a first resistor on the second surface of the substrate; and
forming a first electrically conductive pathway that communicatively couples the first sensor electrode and the amplifier through the first capacitor and the first resistor.
2. The method of claim 1 wherein depositing at least a first layer of a first electrically conductive material on the first surface of the substrate includes depositing a first layer including copper on the first surface of the substrate, and wherein forming the first sensor electrode further includes depositing a second layer of a second electrically conductive material on the first layer of the first electrically conductive material, the second electrically conductive material including a material selected from the group consisting of: gold, steel, stainless steel, silver, titanium, electrically conductive rubber, and electrically conductive silicone.
3. The method of claim 2 , further comprising:
enclosing the substrate in a housing, wherein the housing includes a hole, and wherein enclosing the substrate in a housing includes enclosing the amplifier, the first capacitor, and the first resistor in the housing and aligning the first sensor electrode with the hole, wherein at least a portion of the second layer of the second electrically conductive material protrudes out of the housing through the hole.
4. The method of claim 1 , further comprising:
forming a ground electrode on the first surface of the substrate;
forming a second electrically conductive pathway that communicatively couples to the ground electrode;
depositing a second capacitor on the second surface of the substrate;
forming a third electrically conductive pathway that communicatively couples the first electrically conductive pathway and the second electrically conductive pathway through the second capacitor;
depositing a second resistor on the second surface of the substrate; and
forming a fourth electrically conductive pathway that communicatively couples the first electrically conductive pathway and the second electrically conductive pathway through the second resistor.
5. The method of claim 4 wherein the EMG sensor is a differential EMG sensor, the method further comprising:
forming a second sensor electrode on the first surface of the substrate;
depositing a third capacitor on the second surface of the substrate;
depositing a third resistor on the second surface of the substrate;
forming a fifth electrically conductive pathway that communicatively couples the second sensor electrode and the amplifier through the third capacitor and the third resistor;
depositing a fourth capacitor on the second surface of the substrate;
forming a sixth electrically conductive pathway that communicatively couples the fifth electrically conductive pathway and the second electrically conductive pathway through the fourth capacitor;
depositing a fourth resistor on the second surface of the substrate; and
forming a seventh electrically conductive pathway that communicatively couples the fifth electrically conductive pathway and the second electrically conductive pathway through the fourth resistor.