Underlayer coating compositions for use with photoresists

1. A method for forming a photoresist relief image, comprising:

a) applying on a substrate a layer of a fluid coating composition comprising:

i) a resin; and

ii) a solvent component comprising one or more of N-methyl pyrrolidine and benzyl benzoate;

b) applying a layer of a photoresist composition above the coating composition layer; and

c) imaging the photoresist composition layer with activating radiation and developing the imaged photoresist composition layer to provide a photoresist composition relief image.

2. The method of claim 1 wherein at least 0.5 weight percent of the total weight percent of all solvent present in the coating composition has a boiling of 200° C. or greater.

3. The method of claim 2 wherein no more than 20 weight percent of the total weight percent of all solvent present in the coating composition has a boiling of 200° C. or greater.

4. The method of claim 1 wherein the coating composition further comprises a crosslinker component.

5. The method of claim 4 wherein the solvent component comprises N-methyl pyrrolidine.

6. The method of claim 4 wherein the solvent component comprises benzyl benzoate.

7. The method of claim 1 wherein the photoresist composition layer is imaged with EUV radiation.

8. The method of claim 1 wherein the coating composition layer is thermally treated to remove solvent and provide a thermally treated coating composition layer having a thickness that does not exceed 100 angstroms.

9. The method of claim 1 wherein the coating composition is spin coated on the substrate and thermally treated to provide a coating composition layer that is at least substantially free of pinholes.

10. The method of claim 1 wherein the solvent component comprises N-methyl pyrrolidine.

11. The method of claim 1 wherein the solvent component comprises benzyl benzoate.