Self-aligned trench isolation in integrated circuits
View Patent ↗An A method for fabricating an integrated circuit (IC) comprising a substrate, a first device, a second device, and a trench in the substrate is described herein. The trench is self-aligned between the first and second devices and comprises a first portion filled with a dielectric material and a second portion filled with a conductive material. The self-aligned placement of the trench provides electrical isolation between the first and second devices and allows for higher packing density without negatively affecting the operation of closely spaced devices in a high density IC.
1. A method, comprising:
forming first and second partial gate structures adjacent one another over a substrate, wherein a defined area in the substrate is located between the first and second partial gate structures;
wherein the first and second partial gate structures have a partial gate layer that has a smaller vertical dimension than a complete gate layer;
forming a self-aligned trench in the defined area between the first and second partial gate structures;
filling a first portion of the self-aligned trench with a dielectric material;
filling a second portion of the self-aligned trench with a conductive material; and
after filling the first and second portions of the self-aligned trench, forming an additional gate layer over the partial gate layer of the first and second partial gate structures to form gate structures with the complete gate layer.
2. The method of claim 1 , wherein forming the first and second partial gate structures comprises forming a dielectric layer over the substrate and forming a partial gate layer over the dielectric layer.
3. The method of claim 1 , further comprising forming first and second doped regions for the first and second partial gate structures, wherein the first and second doped regions are substantially in contact with at least a part of the second filled portion of the self-aligned trench.