Arrangement for protecting electronics from interference radiation
In one exemplary embodiment, an arrangement for protecting electronics from interference radiation includes a housing and a circuit carrier for accommodating the electronics in an interior of the housing. The housing defines an opening for compensating the different pressures inside and outside the housing. The arrangement of the exemplary embodiment is also distinguished by a contact-making element of an electronic component of the electronics arranged between the opening and the circuit carrier in such a manner that the electronics are at least partially screened from interference radiation entering the housing through the opening.
1. An arrangement for protecting electronics from interference radiation, comprises:
a housing and a circuit carrier for accommodating the electronics in an interior of the housing;
wherein the housing defines an opening for compensation of different pressures inside and outside the housing; and
wherein a contact-making element of an electronic component of the electronics is arranged between the opening and the circuit carrier, in such a manner that the electronics are at last partially screened from interference radiation entering the housing through the opening.
2. The arrangement as claimed in claim 1 , wherein the electronic component is connected to the circuit carrier in an electrically-conductive manner by the contact-making element, wherein the electronic component is a functional constituent of a load current circuit for control of a load.
3. The arrangement as claimed in claim 1 , wherein the electronic component is an interference-suppression component.
4. The arrangement as claimed in claim 1 , wherein a configuration of the contact-making element and/or an arrangement of the contact-making element relative to the opening are such that, in consideration of a configuration of the opening and/or of an available installation space in the interior of the housing, a lowest possible level of interference radiation is present on the circuit carrier.
5. The arrangement as claimed in claim 1 , wherein the housing includes a molding which at least partially encloses the opening, for screening of interference radiation.
6. The arrangement as claimed in claim 5 , wherein the molding is disposed in the interior of the housing.
7. The arrangement as claimed in one of claim 5 , wherein the molding incorporates an open region for feedthrough of the contact-making element.