Fingerprint sensing module and method for manufacturing the fingerprint sensing module

1. A fingerprint sensing module comprising:

a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements, wherein said fingerprint sensor device comprises connection pads arranged on said first side of said fingerprint sensing device for connecting said fingerprint sensor device to external circuitry;

a fingerprint sensor device cover structure arranged to cover said fingerprint sensor device, said cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of said sensing module, and a second side facing said sensing array, wherein said cover structure comprises conductive traces arranged on the second side of the cover structure, for electrically connecting said fingerprint sensing module to external circuitry, and wherein a surface area of said cover structure is larger than a surface area of said sensor device; and

a carrier having a first side attached to a second side of said fingerprint sensor device, opposite of said first side of said fingerprint sensor device;

wherein said fingerprint sensor device further comprises wire-bonds electrically connecting said connection pads of said fingerprint sensor device to said conductive traces of said cover structure, said wire-bonds comprising:

wire-bonds between said connection pads of said fingerprint sensor device and said first side of said carrier, and

wire-bonds arranged between a second side of said carrier, opposite of said first side of said carrier, and said conductive traces of said cover structure.

2. The fingerprint sensing module according claim 1 , further comprising mold layer arranged between said sensor device and said cover structure.

3. The fingerprint sensing module according to claim 1 , wherein said cover structure is a laminate structure comprising at least one layer comprising conductive traces and at least one insulating layer.

4. The fingerprint sensing module according to claim 1 , further comprising a passive component, arranged on said second side of said cover structure and electrically connected to the conductive traces of said cover structure.

5. The fingerprint sensing module according to claim 1 , further comprising a passive component arranged on said first side of said carrier and electrically connected to conductive traces of said cover structure.

6. The fingerprint sensing module according to claim 1 , further comprising:

a fingerprint sensor control device attached to a second side of said fingerprint sensor device, said second side being opposite of said first side of said fingerprint sensor device.

7. The fingerprint sensing module according to claim 6 , further comprising wire-bonds electrically connecting said fingerprint sensor control device to conductive traces of said cover structure.

8. The fingerprint sensing module according to claim 6 , further comprising a silicon interposer layer arranged between said fingerprint sensor control device and said second side of said fingerprint sensor device.

9. The fingerprint sensing module according to claim 1 , further comprising an electrically conductive bezel arranged adjacent to said sensing array to provide an electrical connection between a finger placed on said sensing surface and drive signal circuitry of said fingerprint sensing module.

10. The fingerprint sensing module according to claim 1 , wherein said cover structure extends outside of said fingerprint sensor device such that said fingerprint sensing module has a T-shaped profile.

11. The fingerprint sensing module according to claim 1 , wherein said cover structure is flexible.

12. The fingerprint sensing module according to claim 1 , further comprising a secure element.

13. A smart card comprising a fingerprint sensing module according to claim 1 ;

said smart card comprising a recess into which said fingerprint sensing module is arranged;

wherein said cover structure of said fingerprint sensing module comprises connection pads for connecting said conductive traces to corresponding connection pads of a conductive inlay of said smart card.

14. The smart card according to claim 13 , wherein said recess has a shape corresponding to a shape of said fingerprint sensing module.

15. The smart card according to claim 13 , wherein said recess is T-shaped and configured to receive a correspondingly T-shaped fingerprint sensing module.