IP Library Granted Patent US 10,310,654
Granted Patent B2
US 10,310,654 · App. 15/809,168 · Granted Jun 4, 2019

Input device having flexible circuit board

Inventors: Junji Hashida (Niigata-ken, JP); Toru Sawada (Niigata-ken, JP); Yoshifumi Masumoto (Niigata-ken, JP); Atsushi Matsuda (Niigata-ken, JP); Toru Takahashi (Niigata-ken, JP)
Assignee: Alps Alpine Co., Ltd.
G06F3/0412B32B27/38G06F3/044G06F3/047G06F2203/04103G06F2203/04112
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Quick Facts
Patent No.
US 10,310,654
App. No.
15/809,168
Granted
Jun 4, 2019
Kind
B2
Abstract

An input device includes a light-transmissive panel made of synthetic resin, an electrode layer, a decorative layer disposed on an inner surface of the panel, and an inner resin layer disposed on a surface of the decorative layer. The inner resin layer has a connection pattern on a surface thereof. The connection pattern is in electrical communication with the electrode layer. The input device further includes a flexible printed circuit board joined to the surface of the inner resin layer by thermocompression bonding.

Claims (15)

1. An input device comprising:

a panel made of a light-transmissive material, the panel having a light-transmissive area and a light-shielding area;

an electrode layer formed of a light-transmissive material, the electrode layer being disposed on an inner surface of the panel in the light-transmissive area;

a decorative layer formed of a non-light-transmissive material, the decorative layer being disposed on the inner surface of the panel in the light-shielding area;

an inner resin layer disposed on a surface of the decorative layer;

a conductive connection pattern formed on the inner resin layer, the conductive connection pattern being in electrical communication with the electrode layer; and

a flexible printed circuit board overlapping and facing the inner resin layer, the flexible printed circuit board having a wiring pattern formed thereon, the wiring pattern facing and being connected to the conductive connection pattern,

wherein the inner resin layer is formed of a resin material having a softening temperature higher than that of a resin material of which the decorative layer is formed.

2. The input device according to claim 1 , wherein the flexible printed circuit board is attached to the inner resin layer by thermocompression bonding.

3. The input device according to claim 1 , wherein the inner resin layer is formed of a resin material having a modulus of elasticity higher than that of a resin material of which the decorative layer is formed.

4. The input device according to claim 1 , wherein the decorative layer is formed of an acrylic resin and the inner resin layer is formed of an epoxy resin.

5. The input device according to claim 1 , wherein an end of the inner resin layer disposed on the decorative layer forms a step with respect to the surface of the decorative layer, the input device further comprising:

an auxiliary resin layer disposed at the end of the inner resin layer so as to smoothen the step.

6. The input device according to claim 1 , wherein the inner resin layer includes a plurality of sublayers stacked such that an end of an upper sublayer of the inner resin layer is misaligned with an end of a lower sublayer of the inner resin layer.

7. The input device according to claim 1 , wherein the panel is formed of a synthetic resin.

Assignments (2)
CHANGE OF NAME Recorded Feb 1, 2019
From: ALPS ELECTRIC CO., LTD.
To: ALPS ALPINE CO., LTD.
Reel/Frame 048229/0876 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2017
From: HASHIDA, JUNJI; SAWADA, TORU; MASUMOTO, YOSHIFUMI; MATSUDA, ATSUSHI; TAKAHASHI, TORU
To: ALPS ELECTRIC CO., LTD.
Reel/Frame 044091/0001 →
Priority Claims (1)
JP 2015-136492 · Jul 7, 2015 · national
Continuity (2)
Continuation PCTJP2016063207 · Apr 27, 2016
Related Publication 20180074631A1 · Mar 15, 2018