Electronic circuit module
An electronic circuit module includes a circuit board, electronic components, a burying layer, and a conductive film. The circuit board includes a first principal surface on which first electrodes are provided, a second principal surface on which second electrodes including grounding electrodes are provided, and a side surface connecting the first principal surface and the second principal surface. The electronic components are connected to the first electrodes. The burying layer is provided on the first principal surface of the circuit board with the electronic components buried therein. The conductive film is connected to the grounding electrodes. The outer surface of the burying layer includes markings with protruding shapes with respect to the outer surface of the burying layer. The conductive film covers the outer surface of the burying layer.
1. An electronic circuit module comprising:
a multilayer circuit board including a first principal surface on which a first electrode is provided, a second principal surface on which second electrodes including a grounding electrode are provided, a side surface connecting the first principal surface and the second principal surface, and internal conductors including a via conductor and a pattern conductor;
an electronic component connected to the first electrode;
a burying layer provided on the first principal surface of the circuit board with the electronic component buried therein; and
a conductive film connected to the grounding electrode by the via conductor and the pattern conductor; wherein
an outer surface of the burying layer includes a marking including a protruding shape that protrudes with respect to an outer surface of the burying layer, and the conductive film completely covers the marking and the outer surface of the burying layer; and
the circuit board is made of a matrix including a glass fiber enforced insulating resin material or a ceramic material.
2. The electronic circuit module according to claim 1 , wherein the marking is provided using a discharging device.
3. The electronic circuit module according to claim 1 , wherein the conductive film is provided by at least one method selected from a group consisting of sputtering, metal plating, vapor deposition, and CVD.
4. The electronic circuit module according to claim 1 , wherein the burying layer is made of an insulating resin material.
5. The electronic circuit module according to claim 1 , wherein the marking has a flared-out cross-sectional shape.
6. The electronic circuit module according to claim 2 , wherein the marking is provided using an ink jet device.