High power cavity package for light emitters

1. An emitter package comprising:

a body having a bottom member, one or more side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and one or more side members;

the cavity having one or more top side walls extending from the top surface to one or more optic shelves, one or more middle side walls extending from the one or more optic shelves to one or more contact shelves, and one or more bottom side walls extending from the one or more contact shelves to a base surface;

an optical element on and extending between the one or more optic shelves so as to cover at least a portion of the cavity;

one or more electrical conductive pads on the base surface in the cavity;

one or more light emitter chips on the one or more electrical conductive pads, each light emitter chip having one or more light emitters;

one or more shelf contact pads on the one or more contact shelves;

one or more electrical connector wires connected to and extending between the one or more light emitter chips and the one or more shelf contact pads; and

one or more vents formed into the body and extending from the top surface into the cavity, the one or more vents forming a portion of the at least one of the one or more top side walls to vent the cavity.

2. The emitter package of claim 1 , wherein the optical element is a diffuser on and extending between the one or more optic shelves so as to cover a portion of the cavity below the diffuser.

3. The emitter package of claim 1 , wherein the body having the bottom member, the one or more side members extending from the bottom member, and the top surface, wherein the body defines the cavity formed into the top surface and located between the bottom member and one or more side members is a unitary member.

4. The emitter package of claim 1 , comprising:

one electrical conductive pad on the base surface in the cavity;

one emitter chip on the one electrical conductive pad; and

one shelf contact pad on the one or more contact shelves.

5. The emitter package of claim 1 , comprising:

four electrical conductive pads on the base surface in the cavity;

one emitter chip on each of the electrical conductive pads; and

four shelf contact pads on the one or more contact shelves.

6. The emitter package of claim 1 , comprising at least one anode pad and at least one cathode pad on a bottom surface of the bottom member.

7. The emitter package of claim 6 , wherein:

each of the one or more cathode pads is electrically coupled with one of the one or more electrical conductive pads; and

each of the one or more anode pads is electrically coupled with one of the one or more shelf contact pads.

8. The emitter package of claim 7 , wherein:

the cathode pad is electrically connected to a first conductive pad, which is electrically connected through a first emitter chip and a connector wire to a first shelf contact pad, which is electrically connected through one or more first shelf vias to a second conductive pad, which is electrically connected through a second emitter chip and a connector wire to a second shelf contact pad, which is electrically connected through one or more second shelf vias to a third conductive pad, which is electrically connected through a third emitter chip and a connector wire to a third shelf contact pad, which is electrically connected through one or more third shelf vias to a fourth conductive pad, which is electrically connected through a fourth emitter chip and a connector wire to a fourth shelf contact pad, which is electrically connected to the anode pad.

9. The emitter package of claim 7 , wherein a series of electrical connections, the cathode pad electrically connected to a conductive pad that is electrically connected through an emitter chip and connector wire to a shelf contact pad that is then coupled either:

through one or more series of conductive pad, emitter chip, connector wire, and shelf contact pad, or

to an anode pad.

10. The emitter package of claim 1 , wherein:

the one or more electrical conductive pads are each electrically isolated from each other; and/or

the one or more shelf contact pads are each electrically isolated from each other.

11. The emitter package of claim 1 , wherein the base surface includes one or more recessed regions or one or more raised regions around the one or more electrical conductive pads.

12. The emitter package of claim 1 , wherein the one or more vents are formed into the body and extend from the top surface to the one or more bottom side walls, the one or more vents forming a portion of the at least one of the one or more top side walls, and optionally forming a portion of the at least one or more middle side walls.

13. The emitter package of claim 1 , wherein the cavity includes four corners at the top surface, wherein each of the four corners has a rounded relief, wherein one of the rounded reliefs is larger than the other four reliefs.

14. The emitter package of claim 1 , wherein the plurality of emitter chips are electrically connected in series.

15. The emitter package of claim 1 , wherein the plurality of emitters on the one or more emitter chips are configured to emit infrared light.

16. The emitter package of claim 1 , wherein the body is formed of a plastic or ceramic.

17. The emitter package of claim 16 , wherein the ceramic is aluminum nitride or alumina.

18. A method of emitting one or more light beams, the method comprising:

providing the emitter package of claim 1 ; and

emitting light out of the cavity from the one or more light emitters of the one or more light emitter chips.

19. The method of claim 18 , further comprising operating the one or more light emitters in pulse cycles.

20. The method of claim 18 , further comprising operating the one or more light emitters in continuous wave modes.

21. The method of claim 18 , wherein the light emitted from the one or more light emitters is infrared light.

22. A method of manufacturing the emitter package of claim 1 , the method comprising:

forming the body having the cavity;

placing the one or more electrical conductive pads on the base surface in the cavity;

placing the one or more emitter chips on the one or more electrical conductive pads;

placing the one or more shelf contact pads on the one or more contact shelves; and

electrically connecting the one or more emitter chips with the one or more shelf contact pads with one or more electrical connector wires connected to and extending between the one or more emitter chips and the one or more shelf contact pads.

23. An emitter package comprising:

a body having a bottom member, one or more side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and one or more side members;

the cavity having one or more top side walls extending from the top surface to one or more optic shelves, one or more middle side walls extending from the one or more optic shelves to one or more contact shelves, and one or more bottom side walls extending from the one or more contact shelves to a base surface;

one or more electrical conductive pads on the base surface in the cavity;

one or more light emitter chips on the one or more electrical conductive pads, each light emitter chip having one or more light emitters;

one or more shelf contact pads on the one or more contact shelves;

one or more electrical connector wires connected to and extending between the one or more light emitter chips and the one or more shelf contact pads; and

at least one anode pad and at least one cathode pad on a bottom surface of the bottom member;

wherein:

each of the one or more cathode pads is electrically coupled with one of the one or more electrical conductive pads;

each of the one or more anode pads is electrically coupled with one of the one or more shelf contact pads; and

the cathode pad is electrically connected to a first conductive pad, which is electrically connected through a first emitter chip and a connector wire to a first shelf contact pad, which is electrically connected through one or more first shelf vias to a second conductive pad, which is electrically connected through a second emitter chip and a connector wire to a second shelf contact pad, which is electrically connected through one or more second shelf vias to a third conductive pad, which is electrically connected through a third emitter chip and a connector wire to a third shelf contact pad, which is electrically connected through one or more third shelf vias to a fourth conductive pad, which is electrically connected through a fourth emitter chip and a connector wire to a fourth shelf contact pad, which is electrically connected to the anode pad.