Structure for connecting board and connector, board, and method for connecting board and connector

1. A structure comprising a board and a connector secured to an end portion of the board,

the board comprising:

a first dielectric layer,

a signal pattern that is provided on the top face of the first dielectric layer,

a first ground layer that is provided under the first dielectric layer and forms part of a signal transmission circuit in conjunction with the signal pattern, and

an electroconductive end-face film formed on an end face of the end portion of the board in an area that is located directly under the signal pattern, a seen from a position opposite to said end face, and that is remote from the signal pattern and includes an end face of the first ground layer,

the connector comprising:

a center conductor,

an outer conductor provided on the exterior periphery of the center conductor, with an insulator interposed therebetween, and

securing portions that are provided on the outer conductor and secure said connector to the end portion of the board; and

when the connector is seemed to the end portion of the board by the securing portions, the center conductor comes in contact with the signal pattern and the electroconductive end-face film comes in contact with the outer conductor.

2. The structure according to claim 1 , wherein the board is a multilayer board further having one or more layers provided under the first ground layer.

3. The structure according to claim 2 , wherein:

the board comprises:

a second dielectric layer provided under the first ground layer and adjacent said first ground layer and

a second ground layer provided under the second dielectric layer and adjacent said second dielectric layer, and

wherein the electroconductive end-face film is formed on an end face of the end portion of the board in an area that is directly under the signal pattern, as seen from a position opposite to said end face, and that extends from the end face of the first ground layer to the end face of the second ground layer.

4. The structure according to claim 1 , wherein the electroconductive end-face film is a plating film formed by partially plating the board.

5. The structure according to claim 1 , wherein on the end portion of the tubular-shaped outer conductor on the side facing the board, a lower end portion located radially below is set back in the axial direction relative to an upper end portion located radially above, a stepped surface connecting the lower end portion and the upper end portion is formed between the lower end portion and the upper end portion, and,

when the connector is secured to the end portion of the board by the securing portions, the end face of the end portion of the board opposes the end face of the lower end portion and the top face of the end portion of the board opposes the stepped surface.

6. The structure according to claim 1 , wherein the securing portions protrude above the top face of the board from the end portion of the outer conductor on the side facing the board, and said securing portions are secured to the top face of the board via fastening members.

7. The structure according to claim 6 , wherein first bore portions that accept the fastening members therethrough in order to secure the securing portions to the top face of the board are formed in said board, second bore portions that accept the fastening members therethrough in order to secure the securing portions to the top face of the board are formed in said securing portions, and the distance to the first bore portions from the end face of the end portion of the board is longer than the distance to the second bore portions from the portion that the end face of the end portion of the board opposes on the end face of the outer conductor.

8. A board that forms part of a signal transmission circuit, said board comprising:

a dielectric layer,

a signal pattern that is provided on the top face of the dielectric layer,

a ground layer that is provided under the dielectric layer and forms part of the signal transmission circuit in conjunction with the signal pattern, and

an electroconductive end-face film formed on an end face of the end portion of said board in an area that is located directly under the signal pattern, as seen from a position opposite to said end face, and that is remote from the signal pattern and includes the end face of the ground layer; and

when an edge mount type connector comprising a center conductor and an outer conductor provided on the exterior periphery of the center conductor, with an insulator interposed therebetween, is secured to the end portion of said board, the center conductor comes in contact with the signal pattern and the electroconductive end-face film comes in contact with the outer conductor.

9. A method, comprising:

connecting a board comprising a dielectric layer, a signal pattern that is provided on the top face of the dielectric layer, and a ground layer that is provided under the dielectric layer and forms part of a signal transmission circuit in conjunction with the signal pattern, with a connector comprising a center conductor, an outer conductor provided on the exterior periphery of the center conductor, with an insulator interposed therebetween, and securing portions that are provided on the outer conductor and secure said connector to the end portion of the board,

forming an electroconductive end-face film an end face of the end portion of the board in an area that is located directly under the signal pattern, as seen from a position opposite to said end face, and that is remote from the signal pattern and includes the end face of the ground layer, and

securing the connector to the end portion of the board via the securing portions while bringing the center conductor into contact with the signal pattern and while also bringing the electroconductive end-face film into contact with the outer conductor.

10. The method according to claim 9 , wherein the forming of the electroconductive end-face film is accomplished by partially plating the board.