IP Library Granted Patent US 10,921,169
Granted Patent B2
US 10,921,169 · App. 15/814,036 · Granted Feb 16, 2021

Flow sensor, method for manufacturing flow sensor and flow sensor module

Inventors: Tsutomu Kono (Kawasaki, JP); Yuuki Okamoto (Hitachinaka, JP); Takeshi Morino (Hitachinaka, JP); Keiji Hanzawa (Mito, JP)
Assignee: Hitachi Automotive Systems, Ltd.
G01F15/16G01F1/684G01F1/6842G01F1/692H01L23/495H01L29/84H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/49171H01L2224/73265
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Quick Facts
Patent No.
US 10,921,169
App. No.
15/814,036
Granted
Feb 16, 2021
Kind
B2
Abstract

A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

Claims (41)

1. A flow sensor comprising:

a board having an opening;

a flow sensing unit disposed on a surface of the board;

a structure including an air passage groove, wherein

the structure further includes a positioning projection inserted to the opening of the board so that the flow sensing unit is disposed in the air passage groove,

the opening has a continuous edge that is defined by the board,

the air passage groove has a bottom portion which is parallel to the board, and sides which are vertical to the board,

the flow sensing unit is disposed between the sides of the air passage grooves;

an electric control circuit disposed outside the air passage groove and on the board for controlling the flow sensing unit, wherein

a first direction starting from the flow sensing device to the electric control circuit is not parallel to an air flow direction generated by the air passage groove, around the flow sensing unit,

the structure has a longest side wall which is longest wall in the structure,

the air passage groove includes a first passage space in which an air flow direction is parallel to the long side of the structure, a second passage space including around the flow sensing unit, and vending passage space in which an air flow direction is vended vertically.

2. A flow sensor according to claim 1 ,

wherein the positioning projection is disposed on the bottom of the air passage grooves.

3. A flow sensor according to claim 1 ,

wherein a part of the board is disposed in the air passage groove.

4. A flow sensor according to claim 1 ,

wherein the air passage groove further includes a third passage space including an air flow inlet, and another vending passage space in which an air flow direction is vended vertically from an air flow direction around the air flow inlet to the air flow direction in the first passage space.

5. A flow sensor according to claim 1 ,

wherein a partial surface of the board is covered by a resin.

6. A flow sensor comprising:

a board having an opening;

a flow sensing unit disposed on a surface of the board; and

a structure including an air passage groove,

wherein the structure further includes a positioning projection inserted to the opening of the board so that the flow sensing unit is disposed in the air passage groove,

the structure has a longest side wall which is longest wall in the structure, and

the air passage groove includes a first passage space in which an air flow direction is parallel to the long side of the structure, a second passage space extending around the flow sensing unit, and a vending passage space in which an air flow direction is vended vertically.

7. A flow sensor according to claim 6 ,

wherein the air passage groove has a bottom portion which is parallel to the board, and sides which are vertical to the board, and

wherein the flow sensing unit is disposed between the sides of the air passage grooves.

8. A flow sensor according to claim 7 , further comprising:

an electric control circuit disposed outside the air passage groove and on the board for controlling the flow sensing unit,

wherein a first direction starting from the flow sensing device to the electric control circuit is not parallel to an air flow direction generated by the air passage groove, around the flow sensing unit.

9. A flow sensor according to claim 8 ,

wherein a part of the board is disposed in the air passage groove.

10. A flow sensor according to claim 8 ,

wherein the air passage groove further includes a third passage space including an air flow inlet, and another vending passage space in which an air flow direction is vended vertically from an air flow direction around the air flow inlet to the air flow direction in the first passage space.

11. A flow sensor according to claim 6 ,

wherein the positioning projection is disposed on the bottom of the air passage grooves.

12. A flow sensor according to claim 6 ,

wherein a partial surface of the board is covered by a resin.

Assignments (1)
CHANGE OF NAME Recorded Nov 30, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 058481/0935 →