IMPEDANCE MATCHING NETWORK USING HEAT PIPE INDUCTOR
In one embodiment, the invention may be an impedance matching network including an input configured to operably couple to a radio frequency source, an output configured to operably couple to a load, and a first variable capacitor. The matching network may further include an inductor formed from a heat pipe that is wound in a three-dimensional shape. A first heat sink may be coupled adjacent to a first end of the heat pipe, and a second heat sink may be coupled adjacent to a second, opposite end of the heat pipe.
1 . An impedance matching network comprising:
an input configured to operably couple to a radio frequency (RF) source;
an output configured to operably couple to a load;
a first variable capacitor;
an inductor formed from a heat pipe that is wound in a three-dimensional shape;
a first heat sink coupled adjacent to a first end of the heat pipe; and
a second heat sink coupled adjacent to a second, opposite end of the beat pipe.
2 . The matching network of claim 1 wherein the heat pipe is wound in the shape of a cylinder.
3 . The matching network of claim 1 further comprising a fan configured to blow air across the first and second heat sinks.
4 . The matching network of claim 1 wherein the load is a plasma chamber.
5 . The matching network of claim 1 wherein the RF source provides a power of at least 1 kW.
6 . The matching network of claim 1 further comprising a second variable capacitor.
7 . The matching network of claim 6 further comprising a third capacitor in series with the second variable capacitor.
8 . The matching network of claim 7 wherein the third capacitor is a non-variable capacitor.
9 . The matching network of claim 8 wherein:
the first variable capacitor forms part of a first shunt parallel to the RF source;
the second variable capacitor forms part of a second shunt parallel to the load; and
the second shunt comprises the third capacitor.
10 . A method of cooling an impedance matching network, the method comprising:
coupling an inductor to the matching network, the inductor formed from a heat pipe that is wound in a three-dimensional shape;
coupling a first heat sink to a first end of the heat pipe; and
coupling a second heat sink to a second, opposite end of the heat pipe.
11 . The method of claim 10 wherein the heat pipe is wound in the shape of a cylinder.
12 . The method of claim 10 further comprising blowing air across the first and second heat sinks.
13 . The method of claim 10 wherein the matching network is operably coupled to a radio frequency (RF) source and a plasma chamber.
14 . The method of claim 13 wherein the RF source provides a power of at least 1 kW.
15 . A method of manufacturing a semiconductor comprising:
operably coupling a matching network between an RF source and a plasma chamber, the plasma chamber configured to deposit a material layer onto the substrate or etch a material layer from the substrate, and the matching network comprising:
an input configured to operably couple to the RF source;
an output configured to operably couple to the plasma chamber;
a first variable capacitor;
an inductor formed from a heat pipe that is wound in a three-dimensional shape;
a first heat sink coupled adjacent to a first end of the heat pipe; and
a second heat sink coupled adjacent to a second, opposite end of the heat pipe;
placing a substrate in the plasma chamber;
energizing plasma within the plasma chamber by coupling RF power from the RF source into the plasma chamber to perform a deposition or etching; and
controlling a capacitance of the first variable capacitor to achieve an impedance match.
16 . An electronic device comprising:
an inductor formed from a heat pipe that is wound in a three-dimensional shape;
a first heat sink coupled adjacent to a first end of the heat pipe; and
a second heat sink coupled adjacent to a second, opposite end of the heat pipe.
17 . The electronic device of claim 16 wherein the heat pipe is wound in the shape of a cylinder.
18 . The electronic device of claim 16 wherein the inductor has three turns.
19 . The electronic device of claim 16 wherein the inductor is configured to connect to a first variable capacitor and a second variable capacitor.
20 . The electronic device of claim 16 wherein the first and second heat sinks comprise aluminum heat fins.