Low application temperature hot melt adhesive composition and a method including the same
The invention features a hot melt adhesive composition that can be applied at temperatures as low as 107° C., while maintaining excellent bonding under stress and a very fast setting time.
1. A hot melt adhesive composition comprising:
a. from 10% to 30% by weight a homogeneous linear or substantially linear ethylene interpolymer having a Brookfield viscosity of no greater than about 10,000 cps at 177° C.,
b. from greater than about 10% by weight to about 30% by weight of a rosin-ester based tackifying agent,
c. from about 10% by weight to about 40% by weight of a hydrocarbon tackifying agent,
d. from 10% to 35% by weight a paraffin wax, and
e. from 5% to 15% by weight a Fischer Tropsch wax,
wherein the hot melt adhesive composition has a Brookfield viscosity of no greater than about 1400 cps at 120° C., and
wherein the hot melt adhesive composition exhibits a fiber tearing bond at 23° C. when tested according to the Adhesion-Mead Method test.
2. The hot melt adhesive composition of claim 1 wherein the hot melt adhesive composition has a Brookfield viscosity of no greater than about 1000 cps at 120° C.
3. The hot melt adhesive composition of claim 1 wherein the Fischer-Tropsch wax has a congealing point of from about 65° C. to about 95° C.
4. The hot melt adhesive composition of claim 1 wherein the rosin-ester based tackifying agent and the hydrocarbon tackifying agent both have a softening point of from about 75° C. to about 110° C.
5. The hot melt adhesive composition of claim 1 wherein the rosin-ester based tackifying agent and the hydrocarbon tackifying agent both have a softening point of from about 95° C. to about 105° C.
6. The hot melt adhesive composition of claim 1 comprising: from about 15% by weight to about 30% by weight of the rosin-ester based tackifying agent and from about 15% by weight to about 30% by weight of the hydrocarbon tackifying agent.
7. The hot melt adhesive composition of claim 1 wherein said composition is free of maleic anhydride modified components.
8. The hot melt adhesive composition of claim 1 wherein the homogeneous linear or substantially linear ethylene interpolymer is selected from the group consisting of ethylene octene copolymer, ethylene hexene copolymer, ethylene butene copolymer, and ethylene propylene copolymer.
9. The hot melt adhesive composition of claim 1 wherein the homogeneous linear or substantially linear ethylene interpolymer is made with a single site catalyst.
10. The hot melt adhesive composition of claim 1 further comprising a vinyl polymer.
11. The hot melt adhesive composition of claim 1 further comprising an aromatic tackifying agent.
12. The composition of claim 1 further comprising a propylene based polymer.
13. A method of making or closing an article, the method comprising:
a. heating the hot melt adhesive composition of claim 1 ; and
b. applying the hot melt adhesive composition on a substrate at an application temperature of no greater than 121° C.
14. The method of claim 13 wherein the hot melt adhesive composition is applied at a temperature of no greater than 115° C.
15. The method of claim 13 wherein the hot melt adhesive composition is applied at a temperature of no greater than 110° C.
16. The method of claim 13 wherein the article comprises a cellulose based substrate.