Fiber optic transceiver FPGA mezzanine card (FMC)
A fiber optic transceiver FPGA mezzanine card (FMC) is capable of operating in radiation environments. The fiber optic transceiver FMC may be used with radiation-hardened and non-hardened FPGAs. The FMC may enable high speed serial communications, such as gigabit Ethernet, PCI express, serial rapid IO, and/or other high speed serial protocols over the fiber.
1. A fiber optic transceiver Field Programmable Gate Array (FPGA) mezzanine card (FMC), comprising:
a first slot for a first optical transceiver on a first layer of the FMC;
a second slot for a second optical transceiver on the first layer of the FMC;
a first fiber optic cable connector associated with the first slot for the first optical transceiver; and
a second fiber optic cable connector associated with the second slot for the second optical transceiver, wherein
the FMC comprises six layers that improve signal integrity and lower power plane impedance,
one of the six layers comprises a dedicated ground plane that improves signal integrity and reduces noise on the FMC, and
another of the six layers comprises an FMC connector and a plurality of controlled impedance differential pair traces that comprise transmit and receive trace pairs for each of the first slot and the second slot, the plurality of controlled impedance differential pair traces operably connected to the FMC connector.
2. The FMC of claim 1 , wherein both passive and active components are mounted on the FMC.
3. The FMC of claim 1 , wherein the FMC comprises a plurality of capacitors that provide power supply bypassing and improve power stability of the FMC.
4. The FMC of claim 3 , wherein the FMC comprises seven capacitors.
5. The FMC of claim 1 , wherein
a second layer of the six layers comprises a solid ground plane, and
ground pins on the first optical transceiver and the second optical transceiver, and grounded sides of a plurality of capacitors, are directly connected to the ground plane.
6. The FMC of claim 1 , wherein a third layer of the six layers comprises:
a plurality of electrically single-ended traces; and
a plurality of lower speed serial peripheral interface (SPI) connections that control configurations of the first optical transceiver and the second optical transceiver, and are routed on the traces of the third layer.
7. The FMC of claim 1 , wherein a fourth layer of the six layers comprises a dedicated ground plane that improves signal integrity and reduces noise on the FMC.
8. The FMC of claim 1 , wherein
a fifth layer of the six layers comprises a solid power plane,
power from an FMC connector is supplied to the fifth layer, and
the first optical transceiver and the second optical transceiver then draw power from the fifth layer.
9. The FMC of claim 1 , wherein
a sixth layer of the six layers comprises “break-outs” for pins of an FMC connector, and
the pins of the FMC connector comprise small traces that allow each pin to “escape” or “break-out” from FMC connector and then attach to internal traces on the FMC.
10. A fiber optic transceiver Field Programmable Gate Array (FPGA) mezzanine card (FMC), comprising:
a plurality of capacitors that provide power supply bypassing and improve power stability of the FMC; and
a plurality layers that improve signal integrity and lower power plane impedance wherein
one of the plurality of layers comprises a dedicated ground plane that improves signal integrity and reduces noise on the FMC, and
another of the plurality of layers comprises an FMC connector and a plurality of controlled impedance differential pair traces that comprise transmit and receive trace pairs for each of the first slot and the second slot, the plurality of controlled impedance differential pair traces operably connected to the FMC connector.
11. The FMC of claim 10 , wherein
a layer of the six layers comprises a solid ground plane, and
ground pins on a first optical transceiver and a second optical transceiver, and grounded sides of a plurality of capacitors, are directly connected to the ground plane.
12. The FMC of claim 10 , wherein a layer of the plurality of layers comprises:
a plurality of electrically single-ended traces; and
a plurality of lower speed serial peripheral interface (SPI) connections that control configurations of the first optical transceiver and the second optical transceiver, and are routed on the traces of the layer.
13. The FMC of claim 10 , wherein a layer of the plurality of layers comprises a dedicated ground plane that improves signal integrity and reduces noise on the FMC.
14. The FMC of claim 10 , wherein
a layer of the plurality of layers comprises a solid power plane,
power from an FMC connector is supplied to the layer, and
the first optical transceiver and the second optical transceiver then draw power from the layer.
15. The FMC of claim 10 , wherein
a sixth layer of the plurality of layers comprises “break-outs” for pins of an FMC connector, and
the pins of the FMC connector comprise small traces that allow each pin to “escape” or “break-out” from FMC connector and then attach to internal traces on the FMC.
16. A fiber optic transceiver Field Programmable Gate Array (FPGA) mezzanine card (FMC), comprising:
a first layer comprising an FMC connector and a plurality of controlled impedance differential pair traces that comprise transmit and receive trace pairs for each of the first slot and the second slot, the plurality of controlled impedance differential pair traces operably connected to the FMC connector;
a second layer comprising a first ground plane, wherein ground pins on a first optical transceiver and a second optical transceiver and grounded sides of a plurality of capacitors are directly connected to the first ground plane;
a third layer comprising a plurality of electrically single-ended traces and a plurality of lower speed serial peripheral interface (SPI) connections that control configurations of the first optical transceiver and the second optical transceiver, and are routed on the traces of the third layer;
a fourth layer comprising a second ground plane that improves signal integrity and reduces noise on the FMC;
a fifth layer comprising a solid power plane, wherein power from the FMC connector is supplied to the fifth layer and the first optical transceiver and the second optical transceiver then draw power from the fifth layer; and
a sixth layer comprising “break-outs” for pins of the FMC connector, wherein the pins of the FMC connector comprise small traces that allow each pin to “escape” or “break-out” from FMC connector and then attach to internal traces on the FMC.
17. The FMC of claim 16 , wherein both passive and active components are mounted on the FMC.
18. The FMC of claim 16 , wherein the FMC comprises seven capacitors.