Integrated heater and method of manufacture

1. A method of constructing a heater comprising the steps of:

providing a substrate, the substrate being a monolithic body;

forming at least one trench into the substrate;

depositing a functional material onto the substrate and into the at least one trench;

removing excess functional material from the substrate to thereby leave the functional material within the at least one trench of the substrate to form a functional element; and

providing an electrical termination in contact with the functional element.

2. The method according to claim 1 , further comprising forming at least one via through the substrate to at least two corresponding locations on the functional element.

3. The method according to claim 2 , further comprising providing the electrical termination in the at least one via to make the electrical termination in contact with the functional element.

4. The method according to claim 1 , further comprising depositing a dielectric layer over the substrate.

5. The method according to claim 1 , wherein the step of forming at least one trench is achieved by using a deposition and hard mask etching process comprising the steps of:

depositing a hard mask onto the substrate;

depositing a photo resist layer onto the hard mask;

developing the photo resist layer on the hard mask;

etching through the hard mask to form the pattern;

removing the photo resist layer;

etching through the pattern and into the substrate to form the at least one trench; and

removing the hard mask.

6. The method according to claim 1 , wherein the functional material is thermally treated after the functional material is deposited onto the substrate and into the at least one trench.

7. The method according to claim 1 , wherein the step of removing excess functional material comprises a process selected from a group consisting of a chemical-mechanical planarization/polishing (CMP), etching, and polishing.

8. The method according to claim 1 , wherein the at least one trench is formed by a process selected from a group consisting of a laser removal process, a bead blasting process, machining, 3 D sintering/printing/additive manufacturing, green state, molding, waterjet, hybrid laser/water, and dry plasma etching.

9. The method according to claim 1 , wherein the functional material is deposited onto the substrate and into the at least one trench by using a layered process.

10. The method according to claim 9 , wherein the layered process is selected from the group consisting of thick film, thin film, thermal spray, and sol-gel.

11. The method according to claim 1 , wherein the functional material is deposited using a braze reflow process.

12. The method according to claim 11 , wherein the functional material is deposited by melting a metal foil into the at least one trench and onto the substrate.

13. The method of claim 1 , further comprising forming a second trench and melting a foil into the second trench, and bonding the functional element to another substrate or electrical component by using the molten material.

14. The method according to claim 13 , wherein the second trench is formed along a periphery of the substrate.

15. The method according to claim 1 further comprising forming a routing layer using the method of claim 1 and bonding the routing layer to the heater.

16. The method according to claim 1 further comprising forming a tuning layer and bonding the tuning layer to the heater.

17. The method according to claim 1 further comprising forming a via though the functional element.

18. The method according to claim 17 further comprising forming a terminal pin into the via.

19. A heater formed according to the method of claim 1 .

20. The heater according to claim 19 , the substrate is ceramic from group of aluminum nitride, and aluminum oxide and the resistive material is a nickel- titanium alloy formed within the at least one trench using a braze reflow process.