Overlapping, discrete tamper-respondent sensors
Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
1. An electronic assembly package comprising:
an electronic assembly;
an electronic assembly enclosure surrounding, at least in part, the electronic assembly; and
a tamper-respondent electronic circuit structure associated with the electronic assembly enclosure, the tamper-respondent electronic circuit structure comprising:
a first tamper-respondent sensor, the first tamper-respondent sensor comprising:
at least one first layer having opposite first and second sides;
first circuit lines forming at least one first resistive network, the first circuit lines being disposed on at least one of the first side or the second side of the at least one first layer,
a second tamper-respondent sensor, the second tamper-respondent sensor comprising:
at least one second layer having opposite first and second sides;
second circuit lines forming at last one second resistive network, the second circuit lines being disposed on at least one of the first side or the second side of the at least one second layer; and
the first tamper-respondent sensor and the second tamper-respondent sensor being discrete, tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about the electronic assembly; and
wherein the first tamper-respondent sensor and the second tamper-respondent sensor are positioned, at least in part, about the electronic assembly enclosure, and wherein the first tamper-respondent sensor comprises one of an upper tamper-respondent sensor or lower tamper-respondent sensor disposed over a respective upper or lower surface of the electronic assembly enclosure, and the second tamper-respondent sensor comprises an outer sidewall tamper-respondent sensor wrapping around a periphery of the electronic assembly enclosure.
2. A fabrication method comprising:
providing an electronic assembly;
providing an electronic assembly enclosure surrounding, at least in part, the electronic assembly; and
fabricating a tamper-respondent electronic circuit structure, and associating the tamper-respondent electronic circuit structure with the electronic assembly enclosure, the fabricating comprising:
providing a first tamper-respondent sensor, the first tamper-respondent sensor comprising:
at least one first layer having opposite first and second sides; and
first circuit lines forming at least one first resistive network, the first circuit lines being disposed on at least one of the first side or the second side of the at least one first layer;
providing at least one second tamper-respondent sensor, the second tamper-respondent sensor comprising:
at least one second layer having opposite first and second sides; and
second circuit lines forming at least one second resistive network, the second circuit lines being disposed on at least one of the first side or the second side of the at least one second layer; and
defining a secure volume about at least one electronic component to be protected by overlapping, at least in part, the first tamper-respondent sensor and the second tamper-respondent sensor about the at least one electronic component to be protected; and
wherein the first tamper-respondent sensor and the second tamper-respondent sensor are positioned, at least in part, about the electronic assembly enclosure, and wherein the first tamper-respondent sensor comprises one of an upper tamper-respondent sensor or lower tamper-respondent sensor disposed over a respective upper or lower surface of the electronic assembly enclosure, and the second tamper-respondent sensor comprises an outer sidewall tamper-respondent sensor wrapping around a periphery of the electronic assembly enclosure.