Optoelectronic component and method for producing an optoelectronic component
View Patent ↗In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.
1. An optoelectronic component, comprising:
an optically active layer structure on a surface of a planar substrate, wherein the surface in a predefined region is free of optically active layer structure; and
an encapsulation structure having an inorganic encapsulation layer, wherein the inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region, wherein the inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate;
wherein the surface of the substrate at least in the predefined region comprises a structuring, wherein the structuring is configured to increase roughness of the surface; and
wherein the substrate at least in the predefined region at the surface thereof comprises or is formed from an inorganic material.
2. The optoelectronic component of claim 1 ,
wherein the structuring is formed as one undercut or a plurality of undercuts of the substrate, wherein the undercut comprises an opening region that is free of encapsulation layer.
3. The optoelectronic component of claim 1 ,
wherein the structuring is configured to circumferentially surround the optically active layer structure.
4. The optoelectronic component of claim 1 ,
wherein the surface comprises a plurality of structurings offset laterally with respect to one another.
5. The optoelectronic component of claim 1 ,
wherein the structuring has a height that is greater than approximately 1 μm.
6. The optoelectronic component of claim 1 ,
wherein the substrate comprises an inorganic, electrically non-conductive layer, which forms at least one part of the surface of the substrate.
7. The optoelectronic component of claim 1 ,
wherein the structuring comprises or is formed from an organic material.
8. The optoelectronic component of claim 1 ,
wherein the encapsulation structure comprises an organic encapsulation layer on or above the inorganic encapsulation layer, wherein the organic encapsulation layer has a roughness that is lower than the roughness of the inorganic encapsulation layer.
9. The optoelectronic component of claim 1 ,
wherein the inorganic encapsulation layer is formed such that it is hermetically impermeable vis-à-vis diffusion of at least one of water or oxygen.
10. The optoelectronic component of claim 1 ,
wherein the surface of the substrate in the region having the optically active layer structure comprises a further structuring, wherein the further structuring is configured to increase the roughness of the surface.
11. The optoelectronic component of claim 1 ,
wherein the further structuring is configured as light-scattering.
12. The optoelectronic component of claim 1 ,
wherein the inorganic encapsulation layer is formed as a closed layer in the region of the surface of the substrate having the optically active layer structure.
13. The optoelectronic component of claim 6 ,
wherein the substrate comprises a metallic structure, wherein the metallic structure is a metal sheet, a metal film or a metal-coated film.
14. The optoelectronic component of claim 6 ,
wherein the inorganic, electrically non-conductive layer is formed on the metallic structure.
15. A method for producing an optoelectronic component, the method comprising:
forming an optically active layer structure on a surface of a planar substrate,
wherein the surface in a predefined region remains free of optically active layer structure; and
forming an encapsulation structure having an inorganic encapsulation layer,
wherein the inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region,
wherein the inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate;
wherein the surface of the substrate at least in the predefined region is formed with a structuring, wherein the structuring is configured to increase the roughness of the surface; and
wherein the substrate at least in the predefined region at the surface thereof comprises or is formed from an inorganic material.