STORAGE CONTAINER MEMORY DEVICE COOLING MECHANISM
An apparatus comprises a heat sink having a first surface and an interior cavity. A waveguide is formed within the interior cavity and a plurality of devices are mounted on the first surface. Heat that is generated by the plurality of devices is transferred to the heat sink for dissipation. Each device of the plurality of devices includes a radio frequency (RF) transceiver and each RF transceiver includes a transmission line and an antenna. The antenna is positioned to communicate RF signals via the waveguide.
1 . An apparatus comprises:
a heat sink having a first surface and an interior cavity;
a waveguide formed within the interior cavity; and
a plurality of devices mounted on the first surface, wherein heat generated by the plurality of devices is transferred to the heat sink for dissipation, wherein each device of the plurality of devices includes a radio frequency (RF) transceiver, wherein each RF transceiver includes a transmission line and an antenna, and wherein the antenna is positioned to communicate RF signals via the waveguide.
2 . The apparatus of claim 1 , wherein the waveguide comprises one or more of:
an optical material;
a conductive material; and
a dielectric material.
3 . The apparatus of claim 1 , wherein the waveguide comprises one or more of:
a rectangular waveguide;
a circular waveguide;
a circuit board stripline waveguide;
an electromagnetic waveguide;
an optical waveguide; and
an acoustic waveguide.
4 . The apparatus of claim 1 , wherein the heat sink comprises one or more of:
a liquid cooling element;
a heat exchange element;
an airflow element; and
a thermal conductor element.
5 . The apparatus of claim 1 further comprises:
the heat sink having a second surface and the interior cavity; and
a second plurality of devices mounted on the second surface, wherein heat generated by the second plurality of devices is transferred to the heat sink for dissipation, wherein each device of the second plurality of devices includes a second radio frequency (RF) transceiver, wherein each second RF transceiver includes a second transmission line and a second antenna, and wherein the second antenna is positioned to communicate RF signals via the waveguide.
6 . The apparatus of claim 1 , the plurality of devices comprises one or more of:
a storage unit; and
a memory device.
7 . The apparatus of claim 1 further comprises:
the transmission line having a first impedance; and
the antenna having a second impedance, wherein the second impedance substantially matches a first impedance.
8 . The apparatus of claim 1 , wherein the transmission line comprises one or more of:
a coaxial;
a microstrip;
a stripline;
a balanced line; and
a waveguide.
9 . A storage container comprises:
a controller;
a plurality of storage units, wherein each storage unit of the plurality of storage units includes:
a heat sink having a first surface and an interior cavity;
a waveguide formed within the interior cavity; and
a plurality of devices mounted on the first surface, wherein heat generated by the plurality of devices is transferred to the heat sink for dissipation, wherein each device of the plurality of devices includes a radio frequency (RF) transceiver, wherein each RF transceiver includes a transmission line and an antenna, and wherein the antenna is positioned to communicate RF signals via the waveguide.
10 . The storage container of claim 9 , wherein the waveguide comprises one or more of:
an optical material;
a conductive material; and
a dielectric material.
11 . The storage container of claim 9 , wherein the waveguide comprises one or more of:
a rectangular waveguide;
a circular waveguide;
a circuit board stripline waveguide;
an electromagnetic waveguide;
an optical waveguide; and
an acoustic waveguide.
12 . The storage container of claim 9 , wherein the heat sink comprises one or more of:
a liquid cooling element;
a heat exchange element;
an airflow element; and
a thermal conductor element.
13 . The storage container of claim 9 further comprises:
the heat sink having a second surface and the interior cavity; and
a second plurality of devices mounted on the second surface, wherein heat generated by the second plurality of devices is transferred to the heat sink for dissipation, wherein each device of the second plurality of devices includes a second radio frequency (RF) transceiver, wherein each second RF transceiver includes a second transmission line and a second antenna, and wherein the second antenna is positioned to communicate RF signals via the waveguide.
14 . The storage container of claim 9 further comprises:
the transmission line having a first impedance; and
the antenna having a second impedance, wherein the second impedance substantially matches a first impedance.
15 . The storage container of claim 9 , wherein the transmission line comprises one or more of:
a coaxial;
a microstrip;
a stripline;
a balanced line; and
a waveguide.