IP Library Granted Patent US 12,009,438
Granted Patent B2
US 12,009,438 · App. 15/823,896 · Granted Jun 11, 2024

Foil trim approaches for foil-based metallization of solar cells

Inventors: Thomas P. Pass (San Jose, CA); Gabriel Harley (Mountain View, CA)
Assignee: Maxeon Solar Pte. Ltd.
H01L31/02008H01L31/02021H01L31/022441H01L31/0516H01L31/0745H01L31/18Y02E10/50
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Quick Facts
Patent No.
US 12,009,438
App. No.
15/823,896
Granted
Jun 11, 2024
Kind
B2
Abstract

Foil trim approaches for the foil-based metallization of solar cells and the resulting solar cells are described. For example, a method involves attaching a metal foil sheet to a metallized surface of an underlying supported wafer to provide a unified pairing of the metal foil sheet and the wafer. Subsequent to attaching the metal foil sheet, a portion of the metal foil sheet is laser scribed from above to form a groove in the metal foil sheet. Subsequent to laser scribing the metal foil sheet, the unified pairing of the metal foil sheet and the wafer is rotated to provide the metal sheet below the wafer. Subsequent to the rotating, the unified pairing of the metal foil sheet and the wafer is placed on a chuck with the metal sheet below the wafer. The metal foil sheet is torn at least along the groove to trim the metal foil sheet.

Claims (37)

1. A solar cell, comprising:

a wafer having a metallized surface and having an outermost perimeter; and

a metal foil electrically connected to the metallized surface of the wafer, the metal foil comprising:

a first portion of the metal foil inset from the outermost perimeter of the wafer from a plan view perspective to expose a first portion of the wafer along the outermost perimeter of the wafer, the exposed first portion of the wafer including a first chamfered corner and a second chamfered corner of the wafer from the plan view perspective, and the first portion of the metal foil having a first chamfered corner parallel with and entirely retracted from the first chamfered corner of the first portion of the wafer and having a second chamfered corner parallel with and entirely retracted from the second chamfered corner of the first portion of the wafer from the plan view perspective;

a second portion of the metal foil partially overhanging and extending beyond the outermost perimeter of the wafer from the plan view perspective, wherein the overhanging portion of the second portion of the metal foil has a longest dimension less than a longest dimension of the wafer;

a third portion of the metal foil opposite the first portion of the metal foil, the third portion inset from the outermost perimeter of the wafer from the plan view perspective to expose a second portion of the wafer along the outermost perimeter of the wafer, the exposed second portion of the wafer including a third chamfered corner and a fourth chamfered corner of the wafer from the plan view perspective, and the third portion of the metal foil having a third chamfered corner parallel with and entirely retracted from the third chamfered corner of the second portion of the wafer and having a fourth chamfered corner parallel with and entirely retracted from the fourth chamfered corner of the second portion of the wafer from the plan view perspective, and wherein the second portion of the metal foil is continuous with the first portion of the metal foil and with the third portion of the metal foil; and

a fourth portion of the metal foil opposite the second portion of the metal foil, the fourth portion partially overhanging and extending beyond the outermost perimeter of the wafer from the plan view perspective, wherein the overhanging portion of the fourth portion of the metal foil has a longest dimension less than the longest dimension of the wafer, and wherein the fourth portion of the metal foil is continuous with the first portion of the metal foil with the third portion of the metal foil.

2. The solar cell of claim 1 , wherein the metallized surface of the wafer comprises semiconductor regions and a plurality of metal seed material regions on each of the semiconductor regions.

3. The solar cell of claim 2 , wherein the metal foil is electrically connected to the plurality of metal seed material regions.

4. The solar cell of claim 3 , further comprising breaks in the metal foil at locations corresponding to regions between the metal seed material regions.

5. The solar cell of claim 2 , wherein the plurality of metal seed material regions comprises aluminum.

6. The solar cell of claim 1 , wherein the metallized surface of the wafer comprises semiconductor regions, and the metal foil is in direct contact with the semiconductor regions.

7. The solar cell of claim 1 , wherein the metal foil is an aluminum metal foil.

8. The solar cell of claim 7 , wherein the aluminum metal foil is an anodized aluminum metal foil.

9. The solar cell of claim 7 , wherein the aluminum metal foil is not anodized.

10. The solar cell of claim 1 , wherein the solar cell is a back contact solar cell.

11. A solar cell, comprising:

a wafer having alternating N-type and P-type semiconductor regions and having an outermost perimeter; and

a metal foil electrically connected to the alternating N-type and P-type semiconductor regions of the wafer, the metal foil comprising:

a first portion of the metal foil inset from the outermost perimeter of the wafer from a plan view perspective to expose a first portion of the wafer along the outermost perimeter of the wafer, the exposed first portion of the wafer including a first chamfered corner and a second chamfered corner of the wafer from the plan view perspective, and the first portion of the metal foil having a first chamfered corner parallel with and entirely retracted from the first chamfered corner of the first portion of the wafer and having a second chamfered corner parallel with and entirely retracted from the second chamfered corner of the first portion of the wafer from the plan view perspective;

a second portion of the metal foil partially overhanging and extending beyond the outermost perimeter of the wafer from the plan view perspective, wherein the overhanging portion of the second portion of the metal foil has a longest dimension less than a longest dimension of the wafer;

a third portion of the metal foil opposite the first portion of the metal foil, the third portion inset from the outermost perimeter of the wafer from the plan view perspective to expose a second portion of the wafer along the outermost perimeter of the wafer, the exposed second portion of the wafer including a third chamfered corner and a fourth chamfered corner of the wafer from the plan view perspective, and the third portion of the metal foil having a third chamfered corner parallel with and entirely retracted from the third chamfered corner of the second portion of the wafer and having a fourth chamfered corner parallel with and entirely retracted from the fourth chamfered corner of the second portion of the wafer from the plan view perspective, and wherein the second portion of the metal foil is continuous with the first portion of the metal foil and with the third portion of the metal foil; and

a fourth portion of the metal foil opposite the second portion of the metal foil, the fourth portion partially overhanging and extending beyond the outermost perimeter of the wafer from the plan view perspective, wherein the overhanging portion of the fourth portion of the metal foil has a longest dimension less than the longest dimension of the wafer, and wherein the fourth portion of the metal foil is continuous with the first portion of the metal foil with the third portion of the metal foil.

12. The solar cell of claim 11 , further comprising a plurality of metal seed material regions on each of the alternating N-type and P-type semiconductor regions.

13. The solar cell of claim 12 , wherein the metal foil is electrically connected to the plurality of metal seed material regions.

14. The solar cell of claim 13 , further comprising breaks in the metal foil at locations corresponding to regions between the metal seed material regions.

15. The solar cell of claim 12 , wherein the plurality of metal seed material regions comprises aluminum.

16. The solar cell of claim 11 , wherein the metal foil is in direct contact with the alternating N-type and P-type semiconductor regions.

17. The solar cell of claim 11 , wherein the metal foil is an aluminum metal foil.

18. The solar cell of claim 17 , wherein the aluminum metal foil is an anodized aluminum metal foil.

19. The solar cell of claim 17 , wherein the aluminum metal foil is not anodized.

20. The solar cell of claim 11 , wherein the solar cell is a back contact solar cell.

21. The solar cell of claim 1 , wherein the second and the fourth portion of the metal foil include side portions which are within the outermost perimeter of the wafer.

22. The solar cell of claim 1 , wherein the outermost perimeter of the wafer has four major sides, wherein the first and third portions of the metal foil are at opposing first and third major sides of the outermost wafer perimeter, and the second and fourth portions of the metal foil are at opposing second and fourth major sides of the outermost perimeter of the wafer.

23. The solar cell of claim 11 , wherein the outermost perimeter of the wafer has four major sides, wherein the first and third portions of the metal foil are at opposing first and third major sides of the outermost wafer perimeter, and the second and fourth portions of the metal foil are at opposing second and fourth major sides of the outermost perimeter of the wafer.

24. The solar cell of claim 1 , wherein the exposed first portion of the wafer includes an entirety of the first chamfered corner and an entirety of the second chamfered corner of the wafer from the plan view perspective, and wherein the exposed second portion of the wafer includes an entirety of the third chamfered corner and an entirety of the fourth chamfered corner of the wafer from the plan view perspective.

25. The solar cell of claim 11 , wherein the exposed first portion of the wafer includes an entirety of the first chamfered corner and an entirety of the second chamfered corner of the wafer from the plan view perspective, and wherein the exposed second portion of the wafer includes an entirety of the third chamfered corner and an entirety of the fourth chamfered corner of the wafer from the plan view perspective.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2025
From: TOTALENERGIES SE; TOTALENERGIES SOLAR INTL
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 073059/0081 →
SECURITY INTEREST Recorded Jun 27, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067924/0062 →
SECOND LIEN SECURITY INTEREST AGREEMENT Recorded Jun 26, 2024
From: MAXEON SOLAR PTE. LTD
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 071343/0553 →
SECURITY INTEREST Recorded Jun 5, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067637/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2023
From: SUNPOWER CORPORATION
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 062699/0875 →