Liquid cooled chassis
View Patent ↗An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.
1. An information handling system (IHS) comprising:
a node enclosure containing one or more heat-generating functional components;
a cold plate attached to an inner surface of the node enclosure and presenting a conduction surface to a selected at least one of the one or more heat-generating functional components;
a compliant, thermally conductive member placed between the cold plate and the selected at least one of the one or more heat-generating function components;
a spring positioned between the inner surface of the node enclosure and the cold plate to position the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components;
wherein the cold plate, the spring, and the compliant, thermally conductive member comprise a first cold plate assembly that is attached beneath the selected at least one of the one or more heat-generating functional components; and
a second cold plate assembly attached above another one of the one or more heat-generating functional components.
2. The IHS of claim 1 , further comprising a rack having a selected one of one or more node-receiving slots that receives the node enclosure.
3. The IHS of claim 1 , wherein the spring comprises a leaf spring.
4. The IHS of claim 1 , wherein the spring comprises a compression spring.
5. The IHS of claim 1 , wherein the cold plate, the spring, and the compliant, thermally conductive member comprise a first cold plate assembly, the IHS further comprising:
a second cold plate assembly that conductively removes thermal energy from another one of the one or more heat-generating functional components;
a liquid input port and a liquid output port attached to a side of the node enclosure; and
an internal liquid conduit assembly connecting the first and second cold plate assemblies in fluid series between the liquid input and output ports.
6. The IHS of claim 5 , wherein the one or more heat-generating functional components comprise first and second graphics processing units (GPU).
7. The IHS of claim 1 , wherein:
the node enclosure comprises a bottom portion and a top cover;
the first cold plate assembly is attached to the bottom portion of the node enclosure; and
the second cold plate assembly is attached to the top cover.
8. A liquid cooling (LC) subsystem comprising:
a cold plate attachable to an inner surface of a node enclosure of an Information Handling System (IHS) and presenting a conduction surface to a selected one or more heat-generating functional components inside the node enclosure;
a compliant, thermally conductive member placed between the cold plate and the selected at least one of the one or more heat-generating function components;
a spring positionable between the inner surface of the node enclosure and the cold plate to position the conduction surface into conductive proximity with the selected one or more heat-generating functional components;
wherein the cold plate, the spring, and the compliant, thermally conductive member comprise a first cold plate assembly that is attached beneath the selected at least one of the one or more heat-generating functional components; and
the LC subsystem further comprising a second cold plate assembly that is attached above another one of the one or more heat-generating functional components.
9. The LC subsystem of claim 8 , wherein the spring comprises a leaf spring.
10. The LC subsystem of claim 8 , wherein the spring comprises a compression spring.
11. The LC subsystem of claim 8 , wherein:
the second cold plate assembly conductively removes thermal energy from another one of the one or more heat-generating functional components; and
the LC subsystem further comprises:
a liquid input port and a liquid output port attached to a selected side of the node enclosure; and
an internal liquid conduit assembly connecting the first and second cold plate assemblies in fluid series between the liquid input and output ports.
12. The LC subsystem of claim 8 , further comprising:
a rack-mounted supply conduit attachable between a liquid supply and a liquid input port; and
a rack-mounted return conduit attachable between a liquid return and a liquid output port.
13. The LC subsystem of claim 8 , wherein:
the first cold plate assembly is attached to a bottom portion of the node enclosure; and
the second cold plate assembly is attached to a top cover.
14. A method comprising:
attaching a cold plate of a liquid cooling subsystem to an inner surface of a node enclosure of an information handling system (IHS);
inserting a spring between the cold plate and the inner surface of the node enclosure; and
presenting a conduction surface of the cold plate to a selected one or more heat-generating functional components of the IHS physically located within the node enclosure;
providing a compliant, thermally conductive member placed between the cold plate and the selected at least one of the one or more heat-generating function components;
wherein the cold plate, the spring, and the compliant, thermally conductive member comprise a first cold plate assembly that is attached beneath the selected at least one of the one or more heat-generating functional components; and
providing a second cold plate assembly attached above another one of the one or more heat-generating functional components.
15. The method of claim 14 , wherein:
attaching the cold plate to the inner surface of the node enclosure comprises mounting the cold plate to a top cover of the node enclosure; and
presenting the conduction surface of the cold plate comprises closing the top cover of the node enclosure on a bottom portion of the node enclosure to place the conduction surface into conductive proximity with the selected one or more heat-generating functional components that is attached to the bottom portion.
16. The method of claim 14 , wherein:
attaching the cold plate to the inner surface of the node enclosure comprises mounting the cold plate to a bottom portion of the node enclosure; and
presenting the conduction surface of the cold plate comprises positioning the selected at least one of the one or more heat-generating functional components on top of the cold plate and closing a top cover of the node enclosure on the bottom portion.