IP Library Granted Patent US 10,692,648
Granted Patent B2
US 10,692,648 · App. 15/826,299 · Granted Jun 23, 2020

Magnetic field shielding structure and mobile device including the magnetic field structure

Inventors: Seung Hee Oh (Suwon-si, KR); Doo Ho Park (Suwon-si, KR); Tae Jun Choi (Suwon-si, KR); Sung Nam Cho (Suwon-si, KR); Chang Hak Choi (Suwon-si, KR); Jung Young Cho (Suwon-si, KR)
Assignee: WITS Co., Ltd.
H01F27/346H01F27/288H01F27/289H01F27/2885H01F27/365H02J7/025H02J50/10H02J50/12H02J50/70
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Quick Facts
Patent No.
US 10,692,648
App. No.
15/826,299
Granted
Jun 23, 2020
Kind
B2
Abstract

A magnetic field shielding structure includes a magnetic layer and a resonance reactive shielding circuit including a capacitor and a conductor connected to the capacitor and having a loop form. At least a portion of the magnetic layer overlaps an area surrounded by the conductor in a thickness direction of the magnetic layer.

Claims (43)

1. A magnetic field shielding structure comprising:

a magnetic layer; and

a resonance reactive shielding circuit comprising a capacitor and a conductor, the conductor connected to the capacitor and having a loop form,

wherein the magnetic layer and the conductor are on a same level, and

wherein the conductor surrounds all side surfaces of the magnetic layer.

2. The magnetic field shielding structure of claim 1 , wherein the capacitor is on a surface of the magnetic layer.

3. The magnetic field shielding structure of claim 1 , further comprising:

a bonding layer interposed between the magnetic layer and the conductor and bonding the magnetic layer to the conductor.

4. The magnetic field shielding structure of claim 1 , wherein the conductor is a conductor in a circuit board.

5. The magnetic field shielding structure of claim 1 , wherein the capacitor is a multilayer ceramic capacitor.

6. The magnetic field shielding structure of claim 1 , wherein the conductor is a coil having at least two turns.

7. The magnetic field shielding structure of claim 6 , wherein the coil is a solenoid.

8. The magnetic field shielding structure of claim 6 , wherein different turns of the coil are on a same level.

9. The magnetic field shielding structure of claim 1 , wherein the capacitor and the conductor form an LC circuit.

10. The magnetic field shielding structure of claim 1 , wherein the resonance reactive shielding circuit is electrically isolated.

11. The magnetic field shielding structure of claim 1 , wherein the magnetic layer comprises a plurality of magnetic layers in a stacked structure.

12. The magnetic field shielding structure of claim 1 , further comprising:

an additional resonance reactive shielding circuit.

13. A mobile device comprising:

a mobile device body;

a battery;

a coil portion; and

a magnetic field shielding structure interposed between the battery and the coil portion, the magnetic field shielding structure comprising a magnetic layer and a resonance reactive shielding circuit, the resonance reactive shielding circuit comprising a capacitor and a conductor, the conductor connected to the capacitor and having a loop form,

wherein the magnetic layer and the conductor are on a same level, and

wherein the conductor surrounds all side surfaces of the magnetic layer.

14. A magnetic field shielding structure comprising:

a magnetic layer; and

a resonance reactive shielding circuit configured to block at least a portion of a magnetic field passing through the magnetic layer, the resonance reactive shielding circuit comprising a capacitor and a conductor, the conductor connected to both ends of the capacitor and having a loop form,

wherein the magnetic layer and the conductor are on a same level, and

wherein the conductor surrounds all side surfaces of the magnetic layer.

15. The magnetic field shielding structure of claim 14 , wherein the resonance reactive shielding circuit has a resonant frequency substantially equal to a frequency of the magnetic field.

16. A mobile device comprising:

a mobile device body;

a battery in the mobile device body;

a power receiving coil in the mobile device body, the power receiving coil configured to receive wireless power by either one or both of magnetic induction and magnetic resonance; and

a magnetic field shielding structure in the mobile device body between the battery and the power receiving coil, the magnetic field shielding structure configured to block at least a portion of a magnetic field generated by the power receiving coil from reaching the battery,

wherein the magnetic field shielding structure comprises,

a magnetic layer configured to block at least a portion of the magnetic field generated by the power receiving coil from passing through the magnetic layer, and

a resonance reactive shielding circuit configured to block at least a portion of any leakage magnetic field passing through the magnetic layer from the magnetic field generated by the power receiving coil, the resonance reactive shielding circuit comprising a capacitor and a conductor, the conductor connected to both ends of the capacitor and having a loop form,

wherein the magnetic layer and the conductor are on a same level, and

wherein the conductor surrounds all side surfaces of the magnetic layer.

17. The mobile device of claim 16 , wherein the magnetic layer is further configured to block the at least a portion of the magnetic field generated by the power receiving coil by a magnetic induction method; and

the resonance reactive shielding circuit is further configured to block the at least a portion of any leakage magnetic field passing through the magnetic layer by a magnetic resonance method.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: WITS CO., LTD.
Reel/Frame 050451/0803 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATES FOR THE LAST 2 INVENTORS PREVIOUSLY RECORDED AT REEL: 044253 FRAME: 0352. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Jan 5, 2018
From: OH, SEUNG HEE; PARK, DOO HO; CHOI, TAE JUN; CHO, SUNG NAM; CHOI, CHANG HAK; CHO, JUNG YOUNG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 045009/0948 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2017
From: OH, SEUNG HEE; PARK, DOO HO; CHOI, TAE JUN; CHO, SUNG NAM; CHOI, CHANG HAK; CHO, JUNG YOUNG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 044253/0352 →
Priority Claims (2)
KR 10-2017-0043152 · Apr 3, 2017 · national
KR 10-2017-0045125 · Apr 7, 2017 · national
Continuity (1)
Related Publication 20180286574A1 · Oct 4, 2018