Test apparatus for signal integrity testing of connectors
A test apparatus includes a host compliance printed circuit board having a first circuit plane and a second circuit plane separated by at least one dielectric layer. A first row of surface mount pads are disposed on the first circuit plane. The first row of surface mount pads includes a first pad and a second pad. A second and third row of surface mount pads are disposed on the first circuit plane. A first and second differential pair of circuit lines is disposed on the first circuit plane. The first differential circuit line has one end coupled to the first pad. The second differential circuit line has one end coupled to the second pad. The first and second differential pair of circuit lines extend from the first and second pads and between the second and third rows of surface mount pads.
1. An information handling system comprising:
one or more processor(s);
a system memory coupled to the one or more processors via a system interconnect;
a test apparatus for signal integrity testing of connectors, the test apparatus comprising:
a host compliance printed circuit board having a first circuit plane and a second circuit plane separated by at least one dielectric layer;
a first row of surface mount pads disposed on the first circuit plane, the first row of surface mount pads including a first pad and a second pad;
a second row of surface mount pads disposed on the first circuit plane and spaced from the first row of surface mount pads;
a third row of surface mount pads disposed on the first circuit plane and spaced from the first row of surface mount pads and the second row of surface mount pads; and
a first and second differential pair of circuit lines disposed on the first circuit plane, the first differential circuit line having one end coupled to the first pad, the second differential circuit line having one end coupled to the second pad, the first and second differential pair of circuit lines extending from the first and second pads and between the second and third rows of surface mount pads, the first and second differential pair of circuit lines further extending beyond the second and third rows of surface mount pads; and
a quad small form factor pluggable double density (QSFP DD) connector coupled to the first, second and third rows of surface mount pads.
2. The information handling system of claim 1 , further comprising:
a fourth row of surface mount pads disposed on the first circuit plane and spaced from the second and third rows of surface mount pads, the fourth row of surface mount pads including a third pad and a fourth pad, the first and second differential pair of circuit lines further extending from between the second and third rows of surface mount pads to the fourth row of surface mount pads.
3. The information handling system of claim 2 , further comprising:
the first differential circuit line further having another end coupled to the third pad and the second differential circuit line further having another end coupled to the fourth pad.
4. The information handling system of claim 1 , further comprising:
a test printed circuit board coupled to the QSFP DD connector; and
a network processing device coupled to the test printed circuit board.
5. The information handling system of claim 1 , further comprising:
a compression connector coupled to the fourth row of surface mount pads; and
a plurality of sub-miniature cables coupled to the compression connector.
6. The information handling system of claim 5 , further comprising:
a measurement instrument coupled to the sub-miniature cables, the measurement instrument configured to test at least one test parameter of the QSFP DD connector.
7. The information handling system of claim 6 , wherein the at least one test parameter is an eye diagram.
8. The information handling system of claim 1 , wherein the host compliance printed circuit board further comprises:
a first ground plane;
a second ground plane;
a first dielectric layer located between the first and second ground planes;
a third dielectric layer located between the first ground plane and the first circuit plane; and
a fourth dielectric layer located between the second ground plane and the second circuit plane.
9. The information handling system of claim 1 , wherein the DSFP DD connector is of a DSFP DD device within a network interface device of the information handling system.
10. A test apparatus for signal integrity comprising:
a host compliance printed circuit board having a first circuit plane and a second circuit plane separated by at least one dielectric layer;
a first row of surface mount pads disposed on the first circuit plane, the first row of surface mount pads including a first pad and a second pad;
a second row of surface mount pads disposed on the first circuit plane and spaced from the first row of surface mount pads;
a third row of surface mount pads disposed on the first circuit plane and spaced from the first row of surface mount pads and the second row of surface mount pads; and
a first and second differential pair of circuit lines disposed on the first circuit plane, the first differential circuit line having one end coupled to the first pad, the second differential circuit line having one end coupled to the second pad, the first and second differential pair of circuit lines extending from the first and second pads and between the second and third rows of surface mount pads, the first and second differential pair of circuit lines further extending beyond the second and third rows of surface mount pads; and
a quad small form factor pluggable double density (QSFP DD) connector coupled to the first, second and third rows of surface mount pads.
11. The test apparatus of claim 10 , further comprising:
a fourth row of surface mount pads disposed on the first circuit plane and spaced from the second and third rows of surface mount pads, the fourth row of surface mount pads including a third pad and a fourth pad, the first and second differential pair of circuit lines further extending from between the second and third rows of surface mount pads to the fourth row of surface mount pads.
12. The test apparatus of claim 11 , further comprising:
the first differential circuit line further having another end coupled to the third pad and the second differential circuit line further having another end coupled to the fourth pad.
13. The test apparatus of claim 10 , further comprising:
a test printed circuit board coupled to the QSFP DD connector; and
a network processing device coupled to the test printed circuit board.
14. The test apparatus of claim 10 , further comprising:
a compression connector coupled to the fourth row of surface mount pads; and
a plurality of sub-miniature cables coupled to the compression connector.
15. The test apparatus of claim 14 , further comprising:
a measurement instrument coupled to the sub-miniature cables, the measurement instrument configured to test at least one test parameter of the QSFP DD connector.
16. The test apparatus of claim 15 , wherein the at least one test parameter is an eye diagram.
17. The test apparatus of claim 10 , wherein the host compliance printed circuit board further comprises:
a first ground plane;
a second ground plane;
a first dielectric layer located between the first and second ground planes;
a third dielectric layer located between the first ground plane and the first circuit plane; and
a fourth dielectric layer located between the second ground plane and the second circuit plane.
18. A method of manufacturing a test apparatus, the method comprising:
providing a host compliance printed circuit board having a first circuit plane including a first row of surface mount pads, a second row of surface mount pads and a third row of surface mount pads disposed on the first circuit plane, the first row of surface mount pads including a first pad and a second pad, the host compliance board further including a first differential pair of circuit lines having first ends coupled to the first pad and second ends coupled to a fourth row of surface mount pads;
coupling second ends of a second differential pair of circuit lines to the second pad, the first and second differential pair of circuit lines extending from the first and second pads, respectively, and between the second and third rows of surface mount pads, the first and second differential pair of circuit lines further extending beyond the second and third rows of surface mount pads;
mounting a compression connector to the fourth row of surface mount pads; and
inserting the host compliance printed circuit board into a quad small form factor pluggable double density (QSFP DD) connector, the QSFP DD connector being mounted to a test printed circuit board and coupled to the first, second and third rows of surface mount pads.
19. The method of claim 18 , further comprising:
attaching a plurality of sub-miniature cables to the compression connector; and
connecting a measurement instrument to the sub-miniature cables, the measurement instrument configured to test the QSFP DD connector.