Display device
View Patent ↗According to one embodiment, a display device includes a first substrate including a first resin substrate having a first thermal expansion coefficient, and a first barrier layer having a second thermal expansion coefficient which is lower than the first thermal expansion coefficient, a second substrate including a second resin substrate having a third thermal expansion coefficient which is equal to the first thermal expansion coefficient, and a second barrier layer having a fourth thermal expansion coefficient which is lower than the third thermal expansion coefficient and is equal to the first thermal expansion coefficient, and a display element located between the first resin substrate and the second resin substrate.
1. A manufacturing method of a display device, comprising:
forming a first resin substrate which is obtained by forming a film of a first resin material on a first support substrate, the first resin material being opaque and having a first thermal expansion coefficient;
forming a first barrier layer on the first resin substrate, the first barrier layer having a second thermal expansion coefficient which is lower than the first thermal expansion coefficient;
forming a display portion on the first barrier layer, the display portion including an organic electroluminescence element and a sealing film covering the organic electroluminescence element;
forming a mounting portion on the first barrier layer;
forming a second resin substrate which is obtained by forming a film of a second resin material, the second resin material being transparent;
attaching the display portion and the second resin substrate to each other with an adhesive; and
peeling the first support substrate from the first resin substrate, on which the mounting portion is formed, by radiating a laser beam on the first support substrate.
2. The manufacturing method of the display device of claim 1 , wherein the first thermal expansion coefficient is 20 to 50 ppm/° C.
3. The manufacturing method of the display device of claim 1 , wherein the second thermal expansion coefficient is 0.5 to 3.0 ppm/° C.
4. The manufacturing method of the display device of claim 1 , wherein the first resin substrate is formed of the first resin material including polyimide as a main component.
5. The manufacturing method of the display device of claim 1 , wherein the first barrier layer is formed of an inorganic material including silicon as a main component.
6. The manufacturing method of the display device of claim 1 , wherein the first barrier layer is formed of a multilayer body in which silicon nitride and silicon oxide are alternately stacked.
7. The manufacturing method of the display device of claim 1 , wherein at a time immediately after the display device is formed at a high temperature, the first resin substrate is expanded to a greater degree than the first barrier layer.
8. The manufacturing method of the display device of claim 7 , wherein at a time when the display device is cooled from a high-temperature state, a ratio of contraction of the first resin substrate is greater than a ratio of contraction of the first barrier layer.
9. The manufacturing method of the display device of claim 8 , wherein at the time when the display device is cooled,
a first stress which warps a first peripheral part of the first resin substrate to a side away from the second resin substrate occurs,
a second stress which warps a second peripheral part of the second resin substrate to a side away from the first resin substrate occurs, and
the first stress is substantially equal to the second stress.