IP Library Granted Patent US 10,254,490
Granted Patent B2
US 10,254,490 · App. 15/830,016 · Granted Apr 9, 2019

Optical module and manufacturing method thereof

Inventor: Takanori Suzuki (Tokyo, JP)
Assignee: Oclaro Japan, Inc.
G02B6/4239G02B6/42G02B6/425G02B6/4214G02B6/4226G02B6/4227G02B6/4244G02B6/4257
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Quick Facts
Patent No.
US 10,254,490
App. No.
15/830,016
Granted
Apr 9, 2019
Kind
B2
Abstract

In an optical module including an optical axis adjustment mechanism, the reliability of fixation of a movable portion is enhanced while an adhesive is prevented from flowing out to an unintended portion. An optical module includes an element portion, a manipulation lever, a bank, a support spring, and a reservoir portion. The bank includes a lever-opposing portion having a step face facing a longitudinal side face of the manipulation lever. The support spring is connected at both ends to the element portion and the bank. The reservoir portion is surrounded in a bay shape, in a plan view, by the manipulation lever, the element portion, the support spring, and the bank and stores the adhesive fixing the lever to the substrate. The reservoir portion includes, in the vicinity of a handle of the manipulation lever, an outflow blocking portion blocking the outflow of the adhesive before curing.

Claims (29)

1. An optical module comprising:

an element portion including an optical element optically coupling first and second optical transmission paths, the element portion being disposed on a surface of a substrate;

a manipulation lever connected at one end to the element portion and extended on the substrate surface, the manipulation lever being manipulated when moving the element portion on the substrate surface;

a bank being a projected portion raised from the substrate surface, the bank including a lever-opposing portion including a step face facing a longitudinal side face of the manipulation lever;

a support spring connected at both ends to the element portion and the bank and supporting the element portion;

a reservoir portion being a depressed portion on the substrate, the reservoir portion being surrounded in a bay shape, in a plan view, by the manipulation lever, the element portion, the support spring, and the bank from a connection point with the support spring to the lever-opposing portion; and

an adhesive stored in the reservoir portion and fixing the manipulation lever to the substrate, wherein

the reservoir portion includes, in the vicinity of the other end of the manipulation lever, an outflow blocking portion blocking the outflow of the adhesive before curing.

2. The optical module according to claim 1 , wherein

the outflow blocking portion is a portion of the bank and is a projected portion projecting from the lever-opposing portion toward the other end of the manipulation lever in a plan view.

3. The optical module according to claim 2 , wherein

a distance from the other end of the manipulation lever to the projected portion of the outflow blocking portion is smaller than a distance from a portion of the manipulation lever other than the other end to the lever-opposing portion.

4. The optical module according to claim 1 , wherein

the outflow blocking portion is formed at an opening of the bay shape and is a substrate surface having low wettability with respect to the adhesive compared to an inner region recessed into the bay shape from the opening.

5. The optical module according to claim 1 , wherein

the manipulation lever or the bank includes depressions and projections on a side face facing the reservoir portion.

6. The optical module according to claim 1 , wherein

a plurality of the element portions are arranged on the substrate, and

the manipulation lever, the support spring, and the reservoir portion are provided for each of the element portions.

7. The optical module according to claim 1 , wherein

the substrate is a silicon substrate in which an insulating layer and a surface silicon layer are stacked in order on a surface of the substrate, and

the element portion, the manipulation lever, the support spring, and the bank are integrally formed in the surface silicon layer.

8. The optical module according to claim 1 , wherein

the adhesive is a UV curable resin or solder.

9. A manufacturing method of the optical module according to claim 1 , comprising:

a step of forming the element portion, the manipulation lever, the support spring, the bank, and the reservoir portion on the substrate;

an adhesive disposing step of disposing the adhesive in the reservoir portion;

an adjustment step of moving the manipulation lever to adjust the position or direction of the element portion after the adhesive disposing step; and

a step of curing the adhesive to fix the element portion, the manipulation lever, and the support spring to the substrate after the adjustment step.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →
CHANGE OF NAME Recorded Jul 2, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 049669/0609 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2017
From: SUZUKI, TAKANORI
To: OCLARO JAPAN, INC.
Reel/Frame 044282/0638 →
Priority Claims (1)
JP 2016-241061 · Dec 13, 2016 · national
Continuity (1)
Related Publication 20180164517A1 · Jun 14, 2018