Method of cutting glass using a laser
A method having steps of placing a glass sheet having a front surface, a reverse surface and a thickness onto a sacrificial substrate; directing a beam from a laser at the front surface and through the glass sheet; pulsing the beam at a frequency of between 10 kHz and 30 kHz, and at the sacrificial substrate; moving the beam across the glass sheet at a rate of between 30 millimeters per second and 90 millimeters per second; ablating the sacrificial substrate with the beam; generating a superheated vapor in response to the ablating of the sacrificial substrate; and ablating the reverse surface of the glass sheet with the superheated vapor, whereby the glass sheet is cut.
1. A system for cutting a glass sheet having a front surface, a reverse surface, and a thickness, comprising:
a sacrificial substrate, wherein the glass sheet is placed onto the sacrificial substrate such that the reverse surface faces the sacrificial substrate;
a laser, wherein the glass sheet is interposed between the sacrificial substrate and the laser;
a pulsing system coupled to the laser, wherein the pulsing system pulses a beam from the laser at a frequency of from between 10 kHz and 30 kHz; and
a laser control apparatus coupled to the laser, wherein the laser control apparatus is adapted to:
direct a beam from the laser at the front surface of the glass sheet and through the glass sheet onto the sacrificial substrate;
move the beam across the glass sheet at a rate of between 30 millimeters per second and 90 millimeters per second;
ablate the sacrificial substrate with the beam;
generate a superheated vapor in response to the ablating of the sacrificial substrate; and
ablate the reverse surface of the glass sheet with the superheated vapor in response to the superheated vapor being generated, whereby the glass sheet is cut.
2. The system of claim 1 , wherein:
the directing comprises directing a beam from a laser at the front surface having a spot size of less than 5 micrometers.
3. The system of claim 1 , wherein:
the placing comprises placing a glass onto a sacrificial substrate of lavastone.
4. The system of claim 1 , wherein:
the placing comprises placing a glass onto a sacrificial substrate of wonderstone.
5. The system of claim 1 , wherein:
the placing comprises placing a glass onto a sacrificial substrate of silicon nitride.
6. The system of claim 1 , wherein:
the placing comprises placing a glass onto a sacrificial substrate of metal.
7. The system of claim 1 , wherein the system is further configured to:
generate a powder in response to the ablating of the sacrificial substrate.
8. The system of claim 7 , wherein the system is further configured to:
ultrasonically cleanse the glass sheet after the glass sheet is cut.
9. The system of claim 1 , wherein:
the sacrificial substrate is combusted based on the ablating.
10. An apparatus for cutting glass, comprising:
means for placing a glass sheet having a front surface, a reverse surface and a thickness onto a sacrificial substrate such that the reverse surface faces the sacrificial substrate;
means for directing a beam from a laser at the front surface and through the glass sheet;
means for pulsing the beam at a frequency of between 10 kHz and 30 kHz, and at the sacrificial substrate;
means for moving the beam across the glass sheet at a rate of between 30 millimeters per second and 90 millimeters per second;
means for ablating the sacrificial substrate with the beam;
means for generating a superheated vapor in response to the ablating of the sacrificial substrate; and
means for ablating the reverse surface of the glass sheet with the superheated vapor in response to the superheated vapor being generated, whereby the glass sheet is cut.
11. The apparatus of claim 10 , wherein:
the directing comprises directing a beam from a laser at the front surface having a spot size of less than 5 micrometers.
12. The apparatus of claim 10 , wherein:
the placing comprises placing a glass onto a sacrificial substrate of lavastone.
13. The apparatus of claim 10 , wherein:
the placing comprises placing a glass onto a sacrificial substrate of wonderstone.
14. The apparatus of claim 10 , wherein:
the placing comprises placing a glass onto a sacrificial substrate of silicon nitride.
15. The apparatus of claim 10 , wherein:
the placing comprises placing a glass onto a sacrificial substrate of metal.
16. The apparatus of claim 10 , further comprising:
means for generating a powder in response to the ablating of the sacrificial substrate.
17. The apparatus of claim 16 , further comprising:
means for ultrasonically cleaning the glass sheet after the glass sheet is cut.
18. The apparatus of claim 10 , wherein:
the sacrificial substrate is combusted based on the ablating.