Circuit board assemblies having magnetic components

1. A circuit board assembly comprising:

a circuit board including an inner layer;

a magnetic component coupled to the circuit board, the magnetic component including a primary winding and a secondary winding;

a winding interconnect terminal electrically coupled to one of the primary winding and the secondary winding of the magnetic component, the winding interconnect terminal disposed on the circuit board remote from the magnetic component, and the circuit board defining an air gap between the winding interconnect terminal and the magnetic component to provide electrical isolation between the winding interconnect terminal and the other of the primary winding and the secondary winding of the magnetic component;

at least one conductive trace disposed in the inner layer of the circuit board and coupled between the winding interconnect terminal and the primary winding of the magnetic component; and

wherein the at least one conductive trace extends from the magnetic component on a first side of the magnetic component and the winding interconnect terminal is located on a second side of the magnetic component opposite the first side.

2. The assembly of claim 1 , wherein the magnetic component includes a planar magnetic component having at least one winding wound in a single plane.

3. The assembly of claim 2 , wherein the magnetic component includes a transformer.

4. The assembly of claim 2 , wherein the magnetic component includes an inductor.

5. The assembly of claim 1 , wherein the magnetic component includes at least one inner winding layer and at least one outer winding layer.

6. The assembly of claim 1 , wherein the winding interconnect terminal is positioned less than eight millimeters from the magnetic component.

7. The assembly of claim 6 , wherein the winding interconnect terminal is positioned less than or equal to two millimeters from the magnetic component.

8. The assembly of claim 1 , further comprising an insulation barrier disposed in the air gap defined by the circuit board.

9. The assembly of claim 8 , wherein the insulation barrier includes at least one of an insulation lining and a multi-side barrier comprising one or more dielectric components.

10. The assembly of claim 1 , wherein the air gap defined by the circuit board is located on the second side of the magnetic component opposite the first side where the at least one conductive trace extends from the magnetic component.

11. The assembly of claim 1 , wherein the circuit board defines the air gap adjacent at least two sides of the magnetic component.

12. The assembly of claim 1 , wherein the circuit board defines the air gap adjacent at least three sides of the magnetic component.

13. The assembly of claim 1 , wherein the at least one conductive trace is a first conductive trace coupled to the primary winding, the assembly further comprising a second conductive trace coupled to the secondary winding and extending from the magnetic component on a surface of the circuit board on the same side of the magnetic component as the first conductive trace coupled to the primary winding.

14. The assembly of claim 1 , wherein the at least one conductive trace is a first conductive trace coupled to the primary winding, the assembly further comprising a second conductive trace coupled to the secondary winding and extending from the magnetic component on a surface of the circuit board on the different side of the magnetic component than the first conductive trace.

15. The assembly of claim 1 , wherein the primary winding is a first primary winding, the at least one conductive trace is coupled to the first primary winding, and the magnetic component includes a second primary winding, the assembly further comprising a second conductive trace coupled to second primary winding, the first conductive trace and the second conductive trace extending from the magnetic component on different sides of the magnetic component.

16. A method of assembling a circuit board and a magnetic component, the method comprising:

coupling a magnetic component to a circuit board, the magnetic component including a primary winding and a secondary winding;

electrically coupling a winding interconnect terminal to one of the primary winding and the secondary winding of the magnetic component via at least one conductive trace disposed in an inner layer of the circuit board;

positioning the winding interconnect terminal on a surface of the circuit board remote from the magnetic component; and

forming an air gap in the circuit board between the magnetic component and the winding interconnect terminal to provide electrical isolation between the winding interconnect terminal and the other of the primary winding and the secondary winding of the magnetic component;

wherein the at least one conductive trace extends from the magnetic component on a first side of the magnetic component; and

wherein the winding interconnect terminal is positioned away from a second side of the magnetic component opposite the first side.

17. The method of claim 16 , wherein positioning the winding interconnect terminal includes positioning the winding interconnect terminal less than or equal to two millimeters from the magnetic component.

18. The method of claim 16 , further comprising positioning an insulation barrier in the air gap between the winding interconnect terminal and the magnetic component.