Switching element having inclined body layer surfaces
View Patent ↗A switching element includes a semiconductor substrate that includes a first n-type semiconductor layer, a p-type body layer constituted by an epitaxial layer, and a second n-type semiconductor layer separated from the first n-type semiconductor layer by the body layer, a gate insulating film that covers a range across the surface of the first n-type semiconductor layer, the surface of the body layer, and the surface of the second n-type semiconductor layer, and a gate electrode that faces the body layer through the gate insulating film. An interface between the first n-type semiconductor layer and the body layer includes an inclined surface. The inclined surface is inclined such that the depth of the body layer increases as a distance from an end of the body layer increases in a horizontal direction. The inclined surface is disposed below the gate electrode.
1. A switching element comprising:
a semiconductor substrate including:
a first n-type semiconductor layer exposed to a surface of the semiconductor substrate;
a p-type body layer constituted by an epitaxial layer exposed to the surface of the semiconductor substrate; and
a second n-type semiconductor layer exposed to the surface of the semiconductor substrate and separated from the first n-type semiconductor layer by the p-type body layer;
a gate insulating film configured to cover a range across a surface of the first n-type semiconductor layer, a surface of the body layer between the first n-type semiconductor layer and the second n-type semiconductor layer, and a surface of the second n-type semiconductor layer; and
a gate electrode configured to face the body layer between the first n-type semiconductor layer and the second n-type semiconductor layer through the gate insulating film,
wherein an interface between the first n-type semiconductor layer and the body layer includes an inclined surface which is not curved, the inclined surface is inclined such that a depth of the body layer increases as a distance from an end of the body layer increases in a horizontal direction, and the inclined surface is disposed below the gate electrode, and
the interface includes a surface layer portion interface vertically extending downward from the surface of the semiconductor substrate below the gate electrode, the inclined surface is positioned on a lower side of the surface layer portion interface, and an angle of the inclined surface with respect to the surface of the semiconductor substrate is less than 60°.
2. The switching element according to claim 1 , wherein the surface layer portion interface has an angle with respect to the surface of the semiconductor substrate equal to or greater than 80° and equal to or less than 90°.
3. The switching element according to claim 1 , wherein:
the semiconductor substrate includes at least two body layers and two second n-type semiconductor layers, and
the gate insulating film covers a range across a surface of a spacing portion which is a portion positioned between the two body layers in the first n-type semiconductor layer, a portion of the surface of the p-type body layer which is positioned between the spacing portion and one of the second n-type semiconductor layer, and a portion of the surface of the one second n-type semiconductor layer.