Granted Patent B2

US 10,283,725 · App. 15/837,843 · Granted May 7, 2019

Abstract

Claims (10)

1. A method of printing a diode, comprising:

printing a first conductor on a substrate from a first solution;

depositing an organic semiconductor layer onto the first conductor such that the organic semiconductor layer resides on, and is in contact with, the first conductor; and

printing a second conductor onto the organic semiconductor layer from a second solution, wherein at one least one of the first solution and the second solution has an injection enhancement material mixed into the solution.

2. The method of claim 1 , wherein printing the first conductor comprises printing one of silver, gold, copper, nickel, aluminum, indium-tin-oxide, conductive carbon materials, and silver nanowires.

3. The method of claim 1 , wherein forming the organic semiconductor layer comprises forming one of a pi conjugated polymer, poly(triarylamines), poly(phenylene vinylenes), poly(thiophenes), triarylamine containing polymers, ferrocene containing polymers, polysilanes, and triarylamine molecularly doped polymers.

4. The method of claim 1 , wherein the injection enhancement material is one of the group consisting of: tetracyanoquinodimethane, a derivative of tetracyanoquinodimethane, lithium fluoride, lithium carbonate, cesium fluoride, and cesium carbonate.

5. The method of claim 1 , wherein the first solution and the second solution are the same solution.

6. The method of claim 1 , wherein only one of the first solution and the second solution has the injection enhancement material.

7. The method of claim 1 , wherein both the first solution and the second solution have the injection enhancement material.

Assignments (10)