Support structure for lighting devices, corresponding lighting device and method

1. A support structure for electrically-powered lighting devices, the structure comprising:

an elongated laminar substrate having first and second opposed surfaces,

a layer of electrically-conductive material on the first surface of the laminar substrate, the layer including etching forming first electrically-conductive formations extending along the first surface of the laminar substrate,

a distribution of electrically-conductive areas on the second surface of the laminar substrate, the distribution including electrically-conductive areas formed via etching distributed with a constant separation pitch along the second surface of the laminar substrate,

electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and electrically-conductive areas in said distribution, and

a network of second electrically-conductive formations including electrically-conductive ink deposited on the second surface of the laminar substrate, with second electrically-conductive formations in said network electrically connected with electrically-conductive areas in said distribution.

2. The support structure of claim 1 ,

wherein the laminar substrate includes a ribbon-like substrate having opposite sides, and

the distribution of electrically-conductive areas includes pairs of areas distributed with a constant separation pitch along the second surface of the laminar substrate, each pair including mutually opposed electrically-conductive areas positioned at said opposite sides of the laminar substrate.

3. The support structure of claim 1 , further comprising extensions of second electrically-conductive formations in said network extending over electrically-conductive areas in said distribution to facilitate electrical connection therewith.

4. The support structure of claim 1 , further comprising electrically-conductive elements extending bridge-like between second electrically-conductive formations in said network and electrically-conductive areas in said distribution to facilitate electrical connection therebetween.

5. The support structure of claim 1 , wherein the second electrically-conductive formations in said network include mounting lands for electrical components and/or circuits (L, D, C, C 1 , C 2 ).

6. A lighting device, comprising:

a support structure comprising:

an elongated laminar substrate having first and second opposed surfaces,

a layer of electrically-conductive material on the first surface of the laminar substrate, the layer including etching forming first electrically-conductive formations extending along the first surface of the laminar substrate,

a distribution of electrically-conductive areas on the second surface of the laminar substrate, the distribution including electrically-conductive areas formed via etching distributed with a constant separation pitch along the second surface of the laminar substrate,

electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and electrically-conductive areas in said distribution, and

a network of second electrically-conductive formations including electrically-conductive ink deposited on the second surface of the laminar substrate, with second electrically-conductive formations in said network electrically connected with electrically-conductive areas in said distribution; and

at least one electrically-powered light radiation source, the at least one electrically-powered light radiation source electrically coupled with second electrically-conductive formations in said network.

7. The lighting device of claim 6 , wherein the at least one light radiation source includes a LED source.

8. A method of using a support structure, the support structure comprising:

an elongated laminar substrate having first and second opposed surfaces,

a layer of electrically-conductive material on the first surface of the laminar substrate, the layer including etching forming first electrically-conductive formations extending along the first surface of the laminar substrate,

a distribution of electrically-conductive areas on the second surface of the laminar substrate, the distribution including electrically-conductive areas formed via etching distributed with a constant separation pitch along the second surface of the laminar substrate,

electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and electrically-conductive areas in said distribution, and

a network of second electrically-conductive formations including electrically-conductive ink deposited on the second surface of the laminar substrate, with second electrically-conductive formations in said network electrically connected with electrically-conductive areas in said distribution;

the method comprising:

cutting to length said support structure at at least one of said electrically-conductive areas distributed with a constant separation pitch along the second surface of the laminar substrate to form an end portion of the structure.

9. The method of claim 8 , further comprising mounting on said support structure at least one electrically-powered light radiation source the at least one electrically-powered light radiation source electrically coupled with second electrically-conductive formations said network.

10. The method of claim 8 , further comprising cutting said support structure with said at least one light radiation source mounted thereon.

11. The method of claim 8 , further comprising coupling an electrical connector with said end portion formed in said structure.

12. The method of claim 11 , further comprising providing said electrical connector with:

sliding contacts adapted to come into surface contact with electrically-conductive formations on said substrate, or

perforating contacts adapted to perforate a protective layer of said structure to come into contact with electrically-conductive formations on said substrate.