System and method for communication in a semiconductor device

1. A semiconductor device, comprising:

a first data terminal configured to connect to an external control device;

a data output terminal configured to connect to a non-volatile memory (NVM);

control circuitry configured to control a human interface panel;

a first communication interface configured to provide first serial communication between the control circuitry and the external control device;

a second communication interface circuitry configured to provide second serial communication between the control circuitry and the NVM, the second serial communication being high-speed relative to the first serial communication; and

bridge circuitry configured to:

in a normal mode: connect the first data terminal to the first communication interface, and connect the data output terminal to the second communication interface; and

in a bridge mode: connect the first data terminal to the data output terminal such that the external control device has direct high-speed access to the NVM.

2. The semiconductor device according to claim 1 , further comprising:

an interrupt request terminal configured to connect to the external control device;

a data input terminal configured to connect to the NVM; and

interrupt request circuitry configured to issue an interrupt request signal to the external control device,

wherein the bridge circuitry is further configured to:

in the normal mode: connect the interrupt request terminal to the interrupt request circuitry and the data input terminal to the second communication interface; and

in the bridge mode: connect the data input terminal to the interrupt request terminal.

3. The semiconductor device according to claim 2 , wherein, in the normal mode, first data are transferred between the first communication interface and the external control device via the first data terminal, second data is transferred from the second communication interface to the NVM via the data output terminal, and third data is transferred from the NVM to the second communication interface.

4. The semiconductor device according to claim 1 , further comprising:

a chip select terminal configured to connect to the NVM,

wherein the bridge circuitry is further configured to output a signal level to the chip select terminal to select the NVM.

5. The semiconductor device according to claim 1 , further comprising:

a first clock terminal configured to connect to the external control device; and

a second clock terminal configured to connect to the NVM,

wherein the bridge circuitry is further configured to:

in the normal mode, connect the first clock terminal to the first communication interface and connect the second clock terminal to the second communication interface; and

in the bridge mode, connect the first clock terminal to the second clock terminal.

6. The semiconductor device according to claim 1 ,

wherein the first serial communication is an Inter-Integrated Circuit (I2C) communication in which the external control device operates as a master and the semiconductor device operates as a slave, and

wherein the second serial communication is a Serial Peripheral Interface (SPI) communication in which the semiconductor device operates as a master and the non-volatile memory operates as a slave.

7. The semiconductor device according to claim 4 , wherein the bridge circuitry comprises a chip select level setting register configured to control the signal level on the chip select terminal to select the NVM in the bridge mode.

8. The semiconductor device according to claim 4 , further comprising: a selection control terminal configured to connect to the external control device,

wherein the bridge circuitry is further configured to connect the chip select terminal and the selection control terminal in the bridge mode.

9. A human interface device, comprising:

a human interface panel comprising at least one of a display panel, a touch panel and a display touch panel;

a NVM; and

a semiconductor device comprising:

a first data terminal configured to connect to an external control device;

a data output terminal configured connected to the NVM;

control circuitry configured to control the human interface panel;

a first communication interface configured to provide first serial communication between the control circuitry and the external control device;

a second communication interface configured to provide second serial communication between the control circuitry and the NVM, the second serial communication being high-speed relative to the first serial communication; and

bridge circuitry configured to:

in a normal mode: connect the first data terminal to the first communication interface, and connect the data output terminal to the second communication interface; and

in a bridge mode: connect the first data terminal to the data output terminal, to provide the external control device with direct high-speed access to the NVM.

10. The human interface device according to claim 9 , further comprising:

an interrupt request terminal configured to connect to the external control device;

a data input terminal connected to the NVM; and

an interrupt request circuitry configured to issue an interrupt request signal to the external control device,

wherein the bridge circuitry is further configured to:

in the normal mode, connect the interrupt request terminal to the interrupt request circuitry and connect the data input terminal to the second communication interface; and

in the bridge mode, connect the data input terminal to the interrupt request terminal.

11. The human interface device according to claim 9 ,

wherein the first serial communication is an I2C communication in which the external control device operates as a master and the semiconductor device operates as a slave,

wherein the second serial communication is an SPI communication in which the semiconductor device operates as a master and the NVM operates as a slave.

12. An electronic appliance, comprising:

a host-side connector;

host-side bridge circuitry;

a main controller, comprising:

a first host-side data terminal configured for first serial communication with a semiconductor device; and

a host-side data output terminal configured for third serial communication with a NVM in accordance with a same communication specification as a second serial communication,

wherein the host-side bridge circuitry is configured to:

connect the first-host side data terminal to a first data terminal of the semiconductor device in a normal mode, and

connect the host-side data output terminal to the first data terminal of the semiconductor device in a bridge mode; and

a human interface device comprising:

a human interface panel comprising at least one of a display panel, a touch panel and a display touch panel;

a NVM; and

a semiconductor device connected to: the human interface panel;

the NVM; the main controller connected via the host-side connector; and the host-side bridge circuitry, the semiconductor device comprising:

a first data terminal connected to the host-side connector;

a data output terminal connected to the NVM;

control circuitry;

a first communication interface configured to provide:

first serial communication between the control circuitry and an external control device; and

a second communication interface configured to provide second serial communication between the control circuitry and the NVM; and

module-side bridge circuitry configured to:

 in a normal mode, connect the first data terminal to the first communication interface and connect the data output terminal to the second communication interface; and

 in a bridge mode, connect the first data terminal to the data output terminal.

13. The electronic appliance according to claim 12 ,

wherein the semiconductor device further comprises:

an interrupt request terminal connected to the external control device;

a data input terminal connected to the NVM; and

an interrupt request circuitry configured to issue an interrupt request signal to the external control device,

wherein the module-side bridge circuitry is further configured to:

in the normal mode, connect the interrupt request terminal to the interrupt request circuitry and connect the data input terminal to the second communication interface; and

in the bridge mode, wherein the module-side bridge circuitry is configured to connect the data input terminal to the interrupt request terminal,

wherein the main controller further comprises:

an interrupt request reception terminal; and

a host-side data input terminal used for the third serial communication with the NVM,

wherein the host-side bridge circuitry is configured to connect the interrupt request reception terminal to the interrupt request terminal of the semiconductor device in the normal mode, and

wherein the host-side bridge circuitry is configured to connect the host-side data input terminal to the interrupt request terminal of the semiconductor device in the bridge mode.

14. The electronic appliance according to claim 13 ,

wherein the semiconductor device further comprises:

a first clock terminal connected to the external control device; and

a second clock terminal connected to the NVM,

wherein the host-side bridge circuitry is further configured to:

in the normal mode, connect the first clock terminal to the first communication interface and connect the second clock terminal to the second communication interface circuitry; and

in the bridge mode, connect the first clock terminal to the second clock terminal,

wherein the main controller further comprises:

a first host-side clock terminal used for the first serial communication;

a second host-side clock terminal used for the third serial communication;

wherein the host-side bridge circuitry is further configured to:

connect the first host-side clock terminal to the first clock terminal of the semiconductor device in the normal mode, and

connect the second host-side clock terminal to the first clock terminal of the semiconductor device in the bridge mode.

15. The electronic appliance according to claim 12 ,

wherein the first serial communication is an I2C communication in which the external control device operates as a master and the semiconductor device operates as a slave,

wherein the second serial communication is an SPI communication in which the semiconductor device operates as a master and the NVM operates as a slave.

16. The electronic appliance according to claim 14 ,

wherein the semiconductor device further comprises:

a chip select terminal connected to the NVM, and

wherein the module-side bridge circuitry is further configured to output a signal level on the chip select terminal to select the NVM in the bridge mode.

17. The electronic appliance according to claim 14 ,

wherein the semiconductor device further comprises:

a chip select terminal connected to the NVM; and

a selection control terminal connected to the host-side bridge circuitry,

wherein the plurality of module-side switch circuitries are configured to connect the chip select terminal and the selection control terminal in the bridge mode,

wherein the main controller further comprises a host-side chip select terminal, and

wherein the host-side bridge circuitry is configured to connect the selection control terminal to the host-side chip select terminal.

18. The electronic appliance according to claim 17 ,

wherein the main controller further comprises a bus select terminal,

wherein the host-side bridge circuitry comprises first, second, third and fourth host-side switch circuitries each comprising a double throw switch switched in response to a bus select control signal output from the bus select terminal,

wherein the first host-side switch circuitry is further configured to:

connect the first host-side clock terminal to the first clock terminal of the semiconductor device in the normal mode; and

connect the second host-side clock terminal to the first clock terminal in the bridge mode,

wherein the second host-side switch circuitry is configured to connect the first host-side data terminal to the first data terminal of the semiconductor device in the normal mode, and connect the host-side data output terminal to the first data terminal in the bridge mode,

wherein the third host-side switch circuitry is further configured to:

connect the interrupt request reception terminal to the interrupt request terminal of the semiconductor device in the normal mode; and

connect the host-side data input terminal to the interrupt request terminal in the bridge mode, and

wherein the fourth host-side switch circuitry is further configured to connect the host-side chip select terminal to the selection control terminal of the semiconductor device in the bridge mode.

19. The electronic appliance according to claim 14 ,

wherein the main controller further comprises a mode control terminal,

wherein the host-side bridge circuitry comprises:

latch circuitry configured to: latch a mode control signal output from the mode control terminal in response to a signal input to the third host-side connector terminal; and output the latched mode control signal; and,

first, second and third host-side switch circuitries which each include a double throw switch switched in response to the latched mode control signal,

wherein the first host-side switch circuitry is further configured to: connect the first host-side clock terminal to the first clock terminal of the semiconductor device in the normal mode; and connect the second host-side clock terminal to the first clock terminal in the bridge mode,

wherein the second host-side switch circuitry is further configured to:

connect the first host-side data terminal to the first data terminal of the semiconductor device in the normal mode, and

connect the host-side data output terminal to the first data terminal in the bridge mode, and

wherein the third host-side switch circuitry is further configured to:

connect the interrupt request reception terminal to the third interrupt request terminal of the semiconductor device in the normal mode; and

connect the host-side data input terminal to the interrupt request terminal in the bridge mode.

20. The electronic appliance according to claim 14 ,

wherein the main controller further comprises a mode control terminal,

wherein the host-side bridge circuitry is further configured to supply a signal received from the interrupt request terminal of the semiconductor device to the interrupt request reception terminal and the host-side data input terminal,

wherein the host-side bridge circuitry comprises:

latch circuitry configured to:

latch a mode control signal output from the mode control terminal in response to the signal received from the interrupt request terminal; and

output the latched mode control signal; and

first and second host-side switch circuitries which each include a double throw switch switched in response to the latched mode control signal,

wherein the first host-side switch circuitry is further configured to:

connect the first host-side clock terminal to the first clock terminal of the semiconductor device in the normal mode; and

connect the second host-side clock terminal to the first clock terminal in the bridge mode, and

wherein the second host-side switch circuitry is further configured to:

connect the first host-side data terminal to the first data terminal of the semiconductor device in the normal mode; and

connect the host-side data output terminal to the first data terminal in the bridge mode.