IP Library Granted Patent US 10,997,516
Granted Patent B2
US 10,997,516 · App. 15/843,075 · Granted May 4, 2021

Systems and methods for predicting persistent memory device degradation based on operational parameters

Inventors: Viswanath Ponnuru (Bangalore, IN); K. N. Ravishankar (Bangalore, IN); Parmeshwr Prasad (Bengaluru, IN)
Assignee: Dell Products L.P.
G06N7/005G06F3/0619G06F3/0653G06F3/0679G06F11/1048G11C5/04G11C7/04G11C29/52G06F11/1068G06F12/0246G11C2029/0409G11C2029/0411
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Quick Facts
Patent No.
US 10,997,516
App. No.
15/843,075
Granted
May 4, 2021
Kind
B2
Abstract

In accordance with embodiments of the present disclosure, an information handling system may include a processor, a memory system communicatively coupled to the processor, the memory system comprising one or more persistent memory modules, each of the one or more persistent memory modules comprising a volatile memory and a non-volatile memory, and a management controller communicatively coupled to the processor and the memory system. The management controller may be configured to correlate temperature sensor information with one or more other operational parameters associated with the one or more persistent memory modules and predict a likelihood of degradation of the one or more persistent memory modules based on correlation of the temperature sensor information with the one or more other operational parameters.

Claims (29)

1. An information handling system comprising:

a processor; and

a memory system communicatively coupled to the processor, the memory system comprising one or more persistent memory modules, each of the one or more persistent memory modules comprising a volatile memory and a non-volatile memory; and

a management controller communicatively coupled to the processor and the memory system and configured to:

correlate temperature sensor information with one or more other operational parameters associated with the one or more persistent memory modules; and

predict a likelihood of degradation of the one or more persistent memory modules based on correlation of the temperature sensor information with the one or more other operational parameters.

2. The information handling system of claim 1 , wherein the temperature sensor information comprises information indicative of a temperature of the one or more persistent memory modules.

3. The information handling system of claim 1 , wherein the temperature sensor information comprises information indicative of a temperature external to the memory system.

4. The information handling system of claim 1 , wherein the one or more other operational parameters comprise error correction code errors associated with the one or more persistent memory modules.

5. The information handling system of claim 1 , wherein the one or more other operational parameters comprise input/output statistics associated with the one or more persistent memory modules.

6. The information handling system of claim 1 , wherein the one or more other operational parameters comprise health information associated with the one or more persistent memory modules.

7. A method comprising, in an information handling system comprising a memory system comprising one or more persistent memory modules, each of the one or more persistent memory modules comprising a volatile memory and a non-volatile memory:

correlating temperature sensor information with one or more other operational parameters associated with the one or more persistent memory modules; and

predicting a likelihood of degradation of the one or more persistent memory modules based on correlation of the temperature sensor information with the one or more other operational parameters.

8. The method of claim 7 , wherein the temperature sensor information comprises information indicative of a temperature of the one or more persistent memory modules.

9. The method of claim 7 , wherein the temperature sensor information comprises information indicative of a temperature external to the memory system.

10. The method of claim 7 , wherein the one or more other operational parameters comprise error correction code errors associated with the one or more persistent memory modules.

11. The method of claim 7 , wherein the one or more other operational parameters comprise input/output statistics associated with the one or more persistent memory modules.

12. The method of claim 7 , wherein the one or more other operational parameters comprise health information associated with the one or more persistent memory modules.

13. An article of manufacture comprising:

a non-transitory computer-readable medium; and

computer-executable instructions carried on the computer-readable medium, the instructions readable by a processor, the instructions, when read and executed, for causing the processor to, in an information handling system comprising a memory system comprising one or more persistent memory modules, each of the one or more persistent memory modules comprising a volatile memory and a non-volatile memory:

correlate temperature sensor information with one or more other operational parameters associated with the one or more persistent memory modules; and

predict a likelihood of degradation of the one or more persistent memory modules based on correlation of the temperature sensor information with the one or more other operational parameters.

14. The article of claim 13 , wherein the temperature sensor information comprises information indicative of a temperature of the one or more persistent memory modules.

15. The article of claim 13 , wherein the temperature sensor information comprises information indicative of a temperature external to the memory system.

16. The article of claim 13 , wherein the one or more other operational parameters comprise error correction code errors associated with the one or more persistent memory modules.

17. The article of claim 13 , wherein the one or more other operational parameters comprise input/output statistics associated with the one or more persistent memory modules.

18. The article of claim 13 , wherein the one or more other operational parameters comprise health information associated with the one or more persistent memory modules.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045482/0131) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 061749/0924 →
RELEASE OF SECURITY INTEREST AT REEL 045482 FRAME 0395 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058298/0314 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Mar 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 045482/0131 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Mar 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 045482/0395 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2017
From: PONNURU, VISWANATH; RAVISHANKAR, K. N.; PRASAD, PARMESHWR
To: DELL PRODUCTS L.P.
Reel/Frame 044405/0152 →
Continuity (1)
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