IP Library Granted Patent US 10,284,301
Granted Patent B2
US 10,284,301 · App. 15/847,824 · Granted May 7, 2019

Multi-channel transceiver with laser array and photonic integrated circuit

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Quick Facts
Patent No.
US 10,284,301
App. No.
15/847,824
Granted
May 7, 2019
Kind
B2
Abstract

A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.

Claims (25)

1. A photonic integrated circuit (PIC) comprising:

a plurality of optical inlet ports integrated on a surface of the PIC where each individual optical inlet port is configured to optically couple to a corresponding laser diode via a focusing lens;

a plurality of waveguides each coupled to one of the plurality of optical inlet ports;

a plurality of optical splitters each coupled to one of the plurality of waveguides and each optical splitter splits into two or more optical channels and where each optical channel is integrated in the PIC;

a plurality of modulators each coupled to one of the optical channels; and

a plurality of output channels each coupled with one of the modulators.

2. The PIC of claim 1 , wherein the plurality of optical inlet ports have a pitch of about 30 microns to about 150 microns.

3. The PIC of claim 1 , wherein the plurality of optical inlet ports have a pitch of about 40 microns to about 200 microns.

4. The PIC of claim 1 , comprising an optical outlet port, wherein the optical outlet port is coupled with the plurality of output channels such that each individual output channel is capable of being optically coupled with one of a plurality of optical fibers.

5. The PIC of claim 1 , wherein the PIC has more optical output channels than optical inlet ports.

6. The PIC of claim 5 , wherein the number of optical output channels is at least twice the number of optical inlet ports.

7. The PIC of claim 4 , further comprising a wavelength division multiplexing device optically coupled to the optical outlet port.

8. The PIC of claim 1 , further comprising an integrated waveguide for each optical inlet port.

9. The PIC of claim 1 , further comprising an optical splitter optically coupled to each integrated waveguide that splits into two or more optical channels downstream from the optical splitter.

10. The PIC of claim 1 , further comprising an integrated modulator for each optical channel.

11. The PIC of claim 1 , further comprising a substrate defining the PIC, the substrate being silicon.

12. The PIC of claim 1 , further comprising at least one electronic component included in the PIC.

13. The PIC of claim 12 , wherein the at least one electronic component is selected from laser driver, modulator driver, transimpedence amplifier, or combinations thereof.

14. The PIC of claim 12 , further comprising an electronic circuit coupled to the at least one electronic component.

15. The PIC of claim 1 , further comprising at least one optoelectronic component included in the PIC.

16. The PIC of claim 1 , wherein the at least one optoelectronic component includes at least one receiver photodiode.

17. The PIC of claim 5 , wherein the number of optical output channels is at least four times the number of optical inlet ports.

18. The PIC of claim 1 , comprising a modulator for each optical channel.

19. The PIC of claim 15 , wherein the at least one optoelectronic component includes at least one laser diode.

20. The PIC of claim 1 , further comprising on or more arrayed waveguide gratings.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2017
From: XU, XIAOJIE; DONOVAN, MARK
To: FINISAR CORPORATION
Reel/Frame 044441/0979 →
Cited By (1)
US 12,619,035