Method of forming high-voltage transistor with thin gate poly
View Patent ↗A semiconductor device and method of fabricating the same are disclosed. The method includes depositing a polysilicon gate layer over a gate dielectric formed over a surface of a substrate in a peripheral region, forming a dielectric layer over the polysilicon gate layer and depositing a height-enhancing (HE) film over the dielectric layer. The HE film, the dielectric layer, the polysilicon gate layer and the gate dielectric are then patterned for a high-voltage Field Effect Transistor (HVFET) gate to be formed in the peripheral region. A high energy implant is performed to form at least one lightly doped region in a source or drain region in the substrate adjacent to the HVFET gate. The HE film is then removed, and a low voltage (LV) logic FET formed on the substrate in the peripheral region. In one embodiment, the LV logic FET is a high-k metal-gate logic FET.
1. A method of fabricating a semiconductor device comprising:
depositing a polysilicon gate layer over a gate dielectric formed over a surface of a substrate in a peripheral region;
forming a dielectric layer over the polysilicon gate layer;
depositing a height-enhancing (HE) film over the dielectric layer, the HE film comprising an amorphous silicon film or a polysilicon film;
patterning the HE film, the dielectric layer, the polysilicon gate layer and the gate dielectric for a high-voltage Field Effect Transistor (HVFET) gate to be formed in the peripheral region;
implanting the HE film with a pre-amorphizing implant;
performing a high energy implant to form at least one lightly doped region in a source or drain (S/D) region in the substrate adjacent to the HVFET gate;
removing the HE film; and
forming a low voltage (LV) logic FET in the peripheral region, wherein the LV logic FET is a high-k metal-gate (HKMG) logic FET.
2. The method of claim 1 , wherein a depth of the lightly doped region in the substrate is greater than a height of the HVFET gate.
3. The method of claim 1 , wherein removing the HE film comprises a chemical mechanical planarization (CMP), a plasma etch or a combination thereof.
4. The method of claim 1 , wherein performing the high energy implant comprises forming a Lightly Doped Drain (LDD).
5. The method of claim 1 , wherein the HVFET gate comprises a polysilicon gate formed from the patterned polysilicon gate layer, and further comprising forming a silicide on the polysilicon gate.
6. The method of claim 1 , wherein depositing the polysilicon gate layer comprises depositing the polysilicon gate layer over a ONO stack formed over the surface of the substrate in a memory region; and
patterning the HE film, the dielectric layer, the polysilicon gate layer and the gate dielectric, further comprises patterning the dielectric layer, the polysilicon gate layer and the ONO stack for a memory gate (MG) to be formed in the memory region.
7. A method of fabricating a semiconductor device comprising:
depositing a polysilicon gate layer over a ONO stack formed over a surface of a substrate in a memory region and a gate dielectric formed over the surface of the substrate in a peripheral region;
forming a dielectric layer over the polysilicon gate layer;
depositing a height-enhancing (HE) film over the dielectric layer;
patterning the HE film, the dielectric layer, the polysilicon gate layer, the gate dielectric and the ONO stack for a memory gate (MG) to be formed in the memory region and for a high-voltage Field Effect Transistor (HVFET) gate to be formed in the peripheral region;
performing a high energy implant to form at least one lightly doped region in a source or drain (S/D) region in the substrate adjacent to the HVFET gate;
removing the HE film; and
forming a low voltage (LV) logic FET in the peripheral region, wherein the LV logic FET is a high-k metal-gate (HKMG) logic FET.
8. The method of claim 7 , wherein depositing the HE film comprises depositing the HE film to a thickness sufficient to prevent dopants from the high energy implant from reaching a channel underlying the HVFET gate.
9. The method of claim 7 , wherein removing the HE film comprises a chemical mechanical planarization (CMP), a plasma etch or a combination thereof.
10. The method of claim 7 , wherein performing the high energy implant comprises forming a Lightly Doped Drain (LDD).
11. The method of claim 7 , wherein the HVFET gate comprises a polysilicon gate formed from the patterned polysilicon gate layer, and further comprising forming a silicide on the polysilicon gate.
12. The method of claim 7 , wherein patterning the HE film, the dielectric layer, the polysilicon gate layer, the gate dielectric and the ONO stack comprises patterning the HE film, the dielectric layer, the polysilicon gate layer and the ONO stack for the MG, separately from patterning the HE film, the dielectric layer, the polysilicon gate layer and the gate dielectric for the HVFET gate.
13. The method of claim 7 , wherein depositing the HE film comprises depositing an amorphous silicon film or a polysilicon film.
14. The method of claim 13 , further comprising implanting the HE film with a pre-amorphizing implant.
15. A method of fabricating a semiconductor device comprising:
depositing a polysilicon gate layer over a gate dielectric formed over a surface of a substrate;
forming a dielectric layer over the polysilicon gate layer;
depositing a height-enhancing (HE) film over the dielectric layer;
patterning the HE film, the dielectric layer, the polysilicon gate layer and the gate dielectric for a high-voltage Field Effect Transistor (HVFET) gate to be formed over the surface of the substrate;
performing a high energy implant to form at least one lightly doped region in a source or drain (S/D) region in the substrate adjacent to the HVFET gate;
removing the entire HE film; and
forming a low voltage (LV) logic FET over the surface of the substrate, wherein the LV logic FET is a high-k metal-gate (HKMG) logic FET,
wherein the HE film is not included in the semiconductor device, and wherein depositing the HE film comprises depositing an amorphous silicon film or a polysilicon film.
16. The method of claim 15 , further comprising implanting the HE film with a pre-amorphizing implant.
17. The method of claim 15 , wherein removing the HE film comprises a chemical mechanical planarization (CMP), a plasma etch or a combination thereof.
18. The method of claim 15 , wherein performing the high energy implant comprises forming a Lightly Doped Drain (LDD).
19. The method of claim 15 , wherein a depth of the lightly doped region in the substrate is greater than a gate height the HVFET gate above the surface of the substrate.
20. The method of claim 15 , wherein depositing the HE film comprises depositing the HE film to a thickness selected based on thicknesses of the underlying dielectric layer, the polysilicon gate layer, and an energy and dose of the high energy implant to prevent dopants from the high energy implant from reaching a channel underlying the HVFET gate.