IP Library Granted Patent US 10,204,945
Granted Patent B2
US 10,204,945 · App. 15/850,003 · Granted Feb 12, 2019

Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules

Inventors: Hartmut Rudmann (Jona, CH); Jukka Alasirniö (Jääli, FI); Bojan Tesanovic (Steinhausen, CH); Tobias Senn (Zürich, CH); Devanraj Kupusamy (Singapore, SG); Alexander Bietsch (Thalwil, CH)
Assignee: Heptagon Micro Optics Pte. Ltd.
H01L27/14618H01L24/48H01L27/1462H01L27/14625H01L27/14632H01L27/14685H01L27/14687H04N5/2253H04N5/2254H04N5/2257H04N5/2258H01L2224/48091H01L2224/48225H01L2924/181
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Quick Facts
Patent No.
US 10,204,945
App. No.
15/850,003
Granted
Feb 12, 2019
Kind
B2
Abstract

Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

Claims (10)

1. A wafer-level fabrication process for making a plurality of optical modules, the method comprising:

providing a respective beam shaping system over a first surface of each of a plurality of transparent covers;

forming a spacer laterally surrounding each transparent cover, wherein the spacer has respective through-holes each of which is substantially aligned with a corresponding one of the beam shaping systems and corresponds to a respective optical channel, the spacer including first extensions to provide respective alignment edges and second extensions to provide respective adhesion edges, the first and second extensions extending away from the beam shaping systems;

measuring at least one optical property for an optical channel corresponding to each beam shaping system;

modifying a height of one or more of the extensions based on the measuring; and

subsequently bringing each alignment edge into contact with a surface of a respective image sensor, and attaching each adhesion edge either to the surface of the respective image sensor or to a surface of a respective printed circuit board on which the image sensor is mounted.

2. The method of claim 1 wherein forming the spacer includes a plurality of vacuum injection steps.

3. The method of claim 1 wherein modifying a height of one or more of the extensions includes micromachining the one or more extensions.

4. The method of claim 1 wherein the adhesion edges are substantially perpendicular to side surfaces of the transparent covers that are laterally surrounded by the material.

5. The method of claim 1 wherein the material laterally surrounding the respective transparent covers is composed of a vacuum injection molded epoxy.

Assignments (3)
CHANGE OF NAME Recorded Nov 3, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 073476/0659 →
CHANGE OF NAME Recorded Feb 8, 2019
From: HEPTAGON MICRO OPTICS PTE. LTD.
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 048289/0147 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2018
From: RUDMANN, HARTMUT; ALASIRNIÖ, JUKKA; TESANOVIC, BOJAN; SENN, TOBIAS; KUPUSAMY, DEVANRAJ; BIETSCH, ALEXANDER
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 045305/0613 →
Continuity (7)
Division 15119182
Provisional Application 62100615 · Jan 7, 2015
Provisional Application 62044591 · Sep 2, 2014
Provisional Application 62028150 · Jul 23, 2014
Provisional Application 61949468 · Mar 7, 2014
Provisional Application 61941009 · Feb 18, 2014
Related Publication 20180138222A1 · May 17, 2018
Cited By (1)
US 12,527,139