BUFFERED ADHESIVE STRUCTURES FOR WEARABLE PATCHES
The present invention describes multilayered adhesive structures that can be used as adhesives to mount wearable devices onto the skin. The multilayered adhesive structures can comprise a buffer layer sandwiched between two adhesive layers, a first adhesive layer adhering the multilayered adhesive structure to the wearable device and a second adhesive layer adhering the buffer layer to the skin. The buffer layer separates or isolates the wearable device from the skin. By mechanically buffering the wearable device from the skin, the multilayered adhesive structures permit the devices to be skin-mounted for an extended period of time (e.g., a few hours or days) without causing moisture-associated skin injuries such as erythema, maceration, and irritation or inflammation.
1 . A wearable device configured to be adhered to skin, comprising:
a base substrate having a first surface and a second surface;
an integrated circuit mounted to the second surface of the base substrate;
a buffer layer having a first surface and a second surface;
a first adhesion layer adhering to the second surface of the base substrate and to the first surface of the buffer layer; and
a second adhesion layer adhering to the second surface of the buffer layer and adapted to adhere the wearable device to the skin.
2 . The wearable device of claim 1 , wherein the buffer layer comprises a woven fabric layer.
3 . The wearable device of claim 1 , wherein the buffer layer comprises a felted fabric layer.
4 . The wearable device of claim 1 , wherein the buffer layer comprises a mesh fabric layer.
5 . The wearable device of claim 1 , wherein the buffer layer has a thickness of no more than 100 μm.
6 . The wearable device of claim 1 , wherein the base substrate has a thickness of no more than 100 μm.
7 . The wearable device of claim 1 , wherein integrated circuit further includes an antenna configured to conform to the skin.
8 . The wearable device of claim 7 , wherein the antenna permits short-range wireless communication.
9 . The wearable device of claim 8 , wherein the short-range wireless communication is near field communication (NFC) or radio-frequency identification (RFID).
10 . The wearable device of claim 1 , wherein the base substrate is comprised of polyimide, polyethylene terephthalate, polyester, polyurethane, polycarbonate, or a combination thereof.
11 . The wearable device of claim 1 , wherein the buffer layer includes at least one of silk, cotton, microfiber, nylon, polyester, hemp, and bamboo.
12 . A flexible device adapted to be attached to skin, the flexible device comprising:
an antenna providing short-range wireless communications, the antenna comprising:
a base substrate having a first surface and a second surface; and
at least one metal loop disposed on the base substrate;
a chip or an integrated circuit electrically connected to the at least one metal loop;
a buffer layer having a first surface and a second surface;
a first adhesive layer adhering to the second surface of the base substrate and to the first surface of the buffer layer; and
a second adhesive layer adapted to adhere the second surface of the buffer layer to the skin.
13 . The flexible device of claim 12 , wherein the antenna and the integrated circuit enable the flexible device to communicate using near field communication (NFC).
14 . The flexible device of claim 12 , wherein the buffer layer comprises a woven fabric layer.
15 . The flexible device of claim 12 , wherein the buffer layer comprises a felted fabric layer.
16 . The flexible device of claim 12 , wherein the buffer layer has a thickness of no more than 100 μm.
17 . The flexible device of claim 12 , wherein the base substrate has a thickness of no more than 100 μm.
18 . The flexible device of claim 12 , wherein the at least one metal loop has a thickness of no more than 100 μm.
19 . The flexible device of claim 12 , wherein the antenna is flexible or stretchable enabling the flexible device to conform to a surface to which it is applied.
20 . The flexible device of claim 12 , wherein the at least one metal loop is comprised of a metal selected from the group consisting of copper, tin, aluminum, gold, platinum, silver, silver paste, and paste with metallic nanoparticles.
21 . The flexible device of claim 12 , wherein the base substrate is comprised of polyimide, polyethylene terephthalate, polyester, polyurethane, polycarbonate, or a combination thereof.
22 . The flexible device of claim 12 , wherein the buffer layer includes at least one of silk, cotton, microfiber, nylon, polyester, hemp, and bamboo.
23 . The flexible device of claim 12 , wherein the chip or integrated circuit is mounted to the first surface of the base substrate.
24 . The flexible device of claim 12 , wherein the chip or integrated circuit is mounted to the second surface of the base substrate.