LED package using electroform stencil printing
A method for manufacturing light emitting devices, comprising: providing a package body including: (i) a reflector cup defining a cavity and (ii) a plurality of metal pads disposed at a bottom surface of the cavity; performing reservoir stencil printing to deposit a respective solder pattern on each of the metal pads, the reservoir stencil printing being performed using a 3D electroform stencil that is placed over the reflector cup, the 3D electroform stencil including a lip configured to engage one or more sidewalls of the reflector cup, and a reservoir extending away from the lip and into the cavity; placing an LED die on the solder patterns that are formed on the metal pads and performing reflow soldering to attach the LED die to the metal pads.
1. A method for manufacturing a light emitting device, comprising:
providing a package body including: a reflector cup defining a cavity and a plurality of metal pads disposed at a bottom surface of the cavity;
placing a reservoir of a 3D electroform stencil into the cavity of the reflector cup, such that a lip of the 3D electroform stencil engages a top surface of one or more sidewalls of the reflector cup, and the reservoir extends away from the lip and into the cavity;
filling the reservoir of the 3D electroform stencil with solder paste;
pushing the solder paste through one or more apertures that are formed on a bottom surface of the reservoir to deposit a respective solder pattern on each of the metal pads;
placing an LED die on the solder patterns that are formed on the metal pads; and
performing reflow soldering to attach the LED die to the metal pads.
2. The method of claim 1 , wherein the reservoir includes a first group of apertures and a second group of apertures, the first group of apertures being formed at a first location in the bottom surface of the reservoir, and the second group of apertures being formed at a second location in the bottom surface of the reservoir.
3. The method of claim 1 , wherein the reflector cup comprises a reflective silicone molding compound (SMC).
4. The method of claim 1 , wherein the cavity has a depth of 4 mm or less.
5. The method of claim 1 , wherein the cavity includes a top opening, the top opening being larger than a footprint of the LED die by 30% or less.
6. The method of claim 1 , wherein the solder paste includes gold.
7. The method of claim 1 , further comprising forming the 3D electroform stencil by using a mandrel that matches a shape of the cavity.
8. The method of claim 1 , wherein top surfaces of the metal pads are positioned in a central portion of the bottom surface of the cavity.
9. The method of claim 1 , wherein the 3D electroform stencil is formed at least in part of nickel.