Laminated printed circuit board with over-molded light guide
A laminated printed circuit board with over-molded light guide includes a printed circuit board having electronic components mounted on a first face of the printed circuit board, and a bore extending through the printed circuit board. A light emitting diode is mounted on the first face proximate to the bore. An opaque film is fixed onto a second face of the printed circuit board, the opaque film creating an end wall of the bore. A light transmissive polymeric material is applied over each of the electronic components, the light emitting diode and a portion of the first face of the printed circuit board. A portion of the polymeric material extends into the bore and contacts the opaque film defining the end wall of the bore to create a light guide for transmitting light from the light emitting diode through the bore.
1. A laminated printed circuit board with over-molded light guide, comprising:
a printed circuit board having electronic components mounted on a first face of the printed circuit board, and a bore extending through the printed circuit board;
a light emitting diode mounted on the first face proximate to the bore; and
a light transmissive polymeric material applied onto each of the electronic components, the light emitting diode and a portion of the first face of the printed circuit board, a portion of the polymeric material extending into the bore to create a light guide proximate to the light emitting diode.
2. The laminated printed circuit board with over-molded light guide of claim 1 , wherein the light guide includes a texturally modified area defining a light modifier.
3. The laminated printed circuit board with over-molded light guide of claim 2 , wherein the light modifier is a reflector positioned proximate to the light emitting diode.
4. The laminated printed circuit board with over-molded light guide of claim 2 , wherein the light reflector is aligned with an axis of the bore.
5. The laminated printed circuit board with over-molded light guide of claim 2 , wherein the light modifier is a diffuser formed at the end of the light guide within the bore.
6. The laminated printed circuit board with over-molded light guide of claim 1 , further including an opaque film applied over a second face of the printed circuit board.
7. The laminated printed circuit board with over-molded light guide of claim 6 , wherein the opaque film defines an end wall of the bore contacted by the portion of the polymeric material extending into the bore.
8. The laminated printed circuit board with over-molded light guide of claim 6 , wherein light generated by the light emitting diode is blocked from passing through the opaque film except at a location of an indicia, the indicia defining light transparent portions of the opaque film.
9. The laminated printed circuit board with over-molded light guide of claim 6 , further including:
an opaque layer disposed about a perimeter of the printed circuit board and the opaque film; and
an acrylic layer disposed over an outer surface of the opaque film positioned opposite the surface applied over the first face of the printed circuit board, and the acrylic layer disposed over a portion of the opaque layer.
10. The laminated printed circuit board with over-molded light guide of claim 1 , further including a touch capacitive circuit printed onto a second face of the printed circuit board.
11. The laminated printed circuit board with over-molded light guide of claim 1 , further including a reflector film individually applied or ink printed over the light transmissive polymeric material.
12. A laminated printed circuit board with over-molded light guide, comprising:
a printed circuit board having electronic components mounted on a first face of the printed circuit board, and a bore extending through the printed circuit board;
a light emitting diode mounted on the first face proximate to the bore;
an opaque film fixed onto a second face of the printed circuit board, the opaque film creating an end wall of the bore; and
a light transmissive polymeric material applied over each of the electronic components, the light emitting diode and a portion of the first face of the printed circuit board, a portion of the polymeric material extending into the bore and contacting the opaque film defining the end wall of the bore to create a light guide for transmitting light from the light emitting diode through the bore.
13. The laminated printed circuit board with over-molded light guide of claim 12 , further including:
a touch capacitive circuit printed onto the second face of the printed circuit board and positioned between the opaque film and the second face; and
a touch capacitive sensor connected to the second face of the printed circuit board and positioned between the opaque film and the second face.
14. The laminated printed circuit board with over-molded light guide of claim 12 , further including a white film individually applied or ink printed onto a surface of the light transmissive polymeric material directed away from the light guide.
15. The laminated printed circuit board with over-molded light guide of claim 12 , further including an opaque layer positioned about a perimeter of the printed circuit board and the opaque film.
16. The laminated printed circuit board with over-molded light guide of claim 12 , further including an acrylic layer disposed over an outer surface of the opaque film positioned opposite the surface applied over the first face of the printed circuit board, and the acrylic layer disposed over a portion of the opaque layer.
17. The laminated printed circuit board with over-molded light guide of claim 12 , wherein the light guide includes a texturally modified area defining a light modifier, and wherein the light modifier is aligned with an axis of the bore.
18. The laminated printed circuit board with over-molded light guide of claim 17 , wherein the light modifier is a diffuser formed at an end of the light guide within the bore.
19. A laminated printed circuit board with over-molded light guide, comprising:
a printed circuit board of a metal material having electronic components mounted on a first face of the printed circuit board connected to first electrical traces printed on the first face, and a bore extending through the printed circuit board;
a light emitting diode mounted on the first face proximate to the bore and connected to the first electrical traces;
a light transmissive polymeric material overmolded onto the electronic components, the light emitting diode and at least a portion of the first face of the printed circuit board, a portion of the light transmissive polymeric material extending into the bore and contacting an opaque film having a translucent portion therein, the opaque film defining an end wall of the bore to create a light guide for transmitting light from the emitting diode through the bore and to the translucent portion of the opaque film; and
a polymeric material opaque layer positioned about a perimeter of the printed circuit board and a perimeter of the opaque film, and applied onto a surface of the light transmissive polymeric material extending freely beyond the opaque film.
20. The laminated printed circuit board with over-molded light guide of claim 19 , further including:
a touch capacitive circuit and a touch capacitive sensor mounted on a second face of the printed circuit board; and
the opaque film is further applied over the second face of the printed circuit board including over the touch capacitive circuit and the touch capacitive sensor.
21. The laminated printed circuit board with over-molded light guide of claim 20 , wherein:
the opaque film creates an end wall of the bore contacted by the light transmissive polymeric material extending into the bore; and
a face of the opaque layer is substantially co-planar with a face of the opaque film.