Space-efficient pressure relief mechanism for immersion cooling of computing elements
View Patent ↗A cooling apparatus includes a chamber and a pressure-relief element. The chamber includes a coolant in a liquid phase disposed near a heat-generation object. The coolant in the liquid phase dissipates heat from the heat-generation object and is converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature. The pressure-relief element has a conduit. A first end of the conduit is submerged in the coolant in the liquid phase internal to the chamber and a second end of the conduit is connected to atmosphere external to the chamber.
1. A cooling apparatus comprising:
a chamber including a coolant in a liquid phase disposed near one or more heat-generation objects, the coolant in the liquid phase dissipating heat from the one or more heat-generation objects to be converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature; and
a pressure-relief element having a conduit, a first end of which is submerged in the coolant in the liquid phase internal to the chamber and a second end of which is connected to atmosphere external to the chamber; and
a barrier at the second end of the pressure-relief element, the barrier separating an inside of the conduit from the atmosphere.
2. The cooling apparatus of claim 1 , wherein the chamber further comprises a condenser configured to condense heat from the coolant in the vapor phase to convert back the coolant in the vapor phase to the liquid phase.
3. The cooling apparatus of claim 2 , wherein the condenser is surrounded by the coolant in the liquid phase before the coolant in the liquid phase reaches the boiling temperature.
4. The cooling apparatus of claim 2 , wherein the condenser condenses the coolant in the vapor phase back into the liquid phase at a fast enough rate that a percentage volume of the coolant in the vapor phase remains a predetermined fraction of a volume inside the chamber.
5. The cooling apparatus of claim 1 , wherein the pressure-relief element is configured to pull a portion of the coolant in the liquid phase to an inside of the conduit from the chamber when a pressure of the coolant in the vapor phase exceeds a predetermined level.
6. The cooling apparatus of claim 5 , wherein the pressure-relief element is configured to push the portion of the coolant in the liquid phase back to the chamber from the inside of the conduit when the pressure of the coolant in the vapor phase is below the predetermined level.
7. The cooling apparatus of claim 5 , wherein the predetermined level is one atmospheric pressure.
8. The cooling apparatus of claim 1 , wherein the conduit of the pressure-relief element forms an open-air channel between the coolant in the liquid phase and the atmosphere.
9. The cooling apparatus of claim 1 , wherein a pressure of the coolant in the vapor phase inside the chamber is maintained at or below one atmospheric pressure.
10. The cooling apparatus of claim 1 , wherein the coolant includes dielectric materials.
11. A cooled electronic system comprising:
at least one electronics circuit board comprising one or more electronic components; and
a cooling apparatus configured to cool the one or more electronic components,
the cooling apparatus comprising:
a chamber including coolant in a liquid phase disposed near the one or more electronic components, the coolant in the liquid phase dissipating heat from the one or more electronic components to be converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature; and
a pressure-relief element comprising a conduit, a first end of which is submerged in the coolant in the liquid phase internal to the chamber and a second end of which is connected to atmosphere external to the chamber; and
a barrier at the second end of the pressure-relief element, the barrier separating an inside of the conduit from the atmosphere.
12. The cooled electronic system of claim 11 , wherein the chamber further comprises a condenser configured to condense heat from the coolant in the vapor phase to convert back the coolant in the vapor phase to the liquid phase.
13. The cooled electronic system of claim 11 , wherein the condenser is surrounded by the coolant in the liquid phase before the coolant in the liquid phase reaches the boiling temperature.
14. The cooled electronic system of claim 11 , wherein the condenser condenses the coolant in the vapor phase back into the liquid phase at a fast enough rate that a percentage volume of the coolant in the vapor phase remains a predetermined fraction of a volume inside the chamber.
15. The cooled electronic system of claim 11 , wherein the pressure-relief element is configured to pull a portion of the coolant in the liquid phase to an inside of the conduit from the chamber when a pressure of the coolant in the vapor phase exceeds a predetermined level.
16. The cooled electronic system of claim 15 , wherein the pressure-relief element is configured to push the portion of the coolant in the liquid phase back to the chamber from the inside of the conduit when the pressure of the coolant in the vapor phase is below the predetermined level.
17. The cooled electronic system of claim 15 , wherein the predetermined level is one atmospheric pressure.
18. The cooled electronic system of claim 11 , wherein the conduit of the pressure-relief element forms an open-air channel between the coolant in the liquid phase and the atmosphere.