Electronic device
An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.
1. An electronic device, comprising:
a heat source;
a heat-conductive member, comprising a recess thermally connected to the heat source, wherein the heat-conductive member has a first side and a second side opposite to the first side, and the second side is thermally connected to the heat source; and
a heat-dissipating sheet, attached to the heat-conductive member, wherein the heat-dissipating sheet completely covers the recess and comprises a contact portion, a bent portion and a wing portion, the contact portion contacts the first side and covers the recess, the bent portion is connected between the contact portion and the wing portion, and a gap is formed between at least a portion of the wing portion and the first side;
a housing, wherein the heat source, the heat-conductive member and the heat-dissipating sheet are disposed in the housing, and a second gap is formed between at least a portion of the wing portion and the housing.
2. The electronic device as claimed in claim 1 , wherein the recess has a widest opening area, the heat-dissipating sheet has a sheet area, and a ratio of the widest opening area to the sheet area is greater than 25%.
3. An electronic device, comprising:
a heat source;
a heat-conductive member, comprising a recess thermally connected to the heat source; and
a heat-dissipating sheet, attached to the heat-conductive member, wherein the heat-dissipating sheet has a contact portion, a bent portion and a wing portion, the contact portion completely covers the recess, the bent portion connects the contact portion and the wing portion, and a gap is formed between at least a portion of the wing portion and the heat-conductive member.
4. The electronic device as claimed in claim 3 , wherein the heat-dissipating sheet is an aluminum foil, a copper foil or a graphite flake.
5. The electronic device as claimed in claim 3 , wherein the heat-conductive member comprises a first side and a second side, the second side is thermally connected to the heat source, and the heat-dissipating sheet is attached to the first side.
6. The electronic device as claimed in claim 5 , wherein the contact portion contacts the first side and covers the recess, and the gap is formed between at least a portion of the wing portion and the first side.
7. The electronic device as claimed in claim 6 , wherein the first gap is smaller than 1 mm.
8. The electronic device as claimed in claim 6 , wherein the recess has a widest opening area, the heat-dissipating sheet has a sheet area, and a ratio of the widest opening area to the sheet area is greater than 25%.
9. The electronic device as claimed in claim 8 , wherein the ratio of the widest opening area to the sheet area is between 30% and 45%.
10. The electronic device as claimed in claim 6 , wherein an extending distance of the wing portion is between 0.3 mm and 1.5 mm.
11. The electronic device as claimed in claim 6 , wherein an extending distance of the bent portion and the wing portion is between 0.3 mm and 1.5 mm.
12. The electronic device as claimed in claim 6 , wherein the bent portion extends in an extending direction, and an included angle between the extending direction and a vertical direction is 30 degrees.
13. The electronic device as claimed in claim 6 , further comprising a housing, wherein the heat source, the heat-conductive member and the heat-dissipating sheet are disposed in the housing, and a second gap is formed between at least a portion of the wing portion and the housing.
14. The electronic device as claimed in claim 13 , wherein the second gap is smaller than 0.5 mm.
15. The electronic device as claimed in claim 13 , wherein a third gap is formed between the contact portion and the housing, and a ratio of the second gap to the third gap is between 0.1 and 1.
16. The electronic device as claimed in claim 6 , wherein the recess, the contact portion and the heat-dissipating sheet are overlapping with each other on a vertical projection plane, the recess is circular on the vertical projection plane, the contact portion is rectangular on the vertical projection plane, and the heat-dissipating sheet is rectangular on the vertical projection plane.
17. The electronic device as claimed in claim 3 , wherein a thickness of the heat-dissipating sheet is between 0.1 mm and 0.5 mm.
18. An electronic device, comprising:
a heat source;
a heat-conductive member, comprising a recess, wherein the recess is thermally connected to the heat source;
a heat-dissipating sheet, attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess; and
a thermal pad,
wherein the heat-conductive member comprises a first side and a second side, the second side is thermally connected to the heat source, the thermal pad is disposed between the second side and the heat source, and the heat-dissipating sheet is attached to the first side,
wherein the heat-dissipating sheet comprises a contact portion, a bent portion and a wing portion, the contact portion contacts the first side and covers the recess, the bent portion connects the contact portion and the wing portion, and a gap is formed between at least a portion of the wing portion and the first side.
19. The electronic device as claimed in claim 18 , wherein the first gap is smaller than 1 mm.
20. The electronic device as claimed in claim 18 , wherein the recess, the contact portion and the heat-dissipating sheet are overlapping with each other on a vertical projection plane, the recess is circular on the vertical projection plane, the contact portion is rectangular on the vertical projection plane, and the heat-dissipating sheet is rectangular on the vertical projection plane.