LAMINATE, SILICONE RESIN LAYER-ATTACHED SUPPORT SUBSTRATE, SILICONE RESIN LAYER-ATTACHED RESIN SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
The present invention provides a laminate superior in foaming resistance, including a support substrate, a silicone resin layer and a substrate arranged in this order, in which the silicone resin layer contains at least one metal element selected from the group consisting of zirconium, aluminum, and tin.
1 : A laminate, comprising:
a support substrate; a silicone resin layer; and a substrate arranged in this order,
wherein the silicone resin layer comprises at least one metal element selected from the group consisting of zirconium, aluminum, and tin.
2 : The laminate according to claim 1 , wherein the silicone resin layer comprises at least one metal element selected from the group consisting of zirconium and tin.
3 : The laminate according to claim 1 , wherein the silicone resin layer comprises zirconium.
4 : The laminate according to claim 1 , wherein a content of each metal element in the silicone resin layer is 0.02 to 1.5 mass %.
5 : The laminate according to claim 1 , wherein a plurality of substrates are laminated on the support substrate through the silicone resin layer.
6 : The laminate according to claim 1 , wherein the substrate is a glass substrate.
7 : The laminate according to claim 1 , wherein the substrate is a resin substrate.
8 : The laminate according to claim 7 , wherein the resin substrate is a polyimide resin substrate.
9 : The laminate according to claim 1 , wherein the substrate is a substrate comprising a semiconductor material.
10 : The laminate according to claim 9 , wherein the semiconductor material is Si, SiC, GaN, gallium oxide, or diamond.
11 : A silicone resin layer-attached support substrate, comprising:
a support substrate and a silicone resin layer arranged in this order,
wherein the silicone resin layer comprises at least one metal element selected from the group consisting of zirconium, aluminum, and tin.
12 : A method for manufacturing an electronic device, the method comprising:
forming an electronic device member on a surface of the substrate of the laminate according to claim 1 , to obtain an electronic device member-attached laminate; and
removing a silicone resin layer-attached support substrate, which includes the support substrate and the silicone resin layer, from the electronic device member-attached laminate, to obtain the electronic device comprising the substrate and the electronic device member.
13 : A silicone rein layer-attached resin substrate, comprising:
a resin substrate and a silicone resin layer arranged in this order,
wherein the silicone resin layer contains at least one metal element selected from the group consisting of zirconium, aluminum, and tin.
14 : A method for manufacturing an electronic device, the method comprising:
forming a laminate using the silicone resin layer-attached resin substrate according to claim 13 , and a support substrate;
forming an electronic device member on a surface of the resin substrate of the laminate, to obtain an electronic device member-attached laminate; and
removing the support substrate and the silicone resin layer from the electronic device member-attached laminate, to obtain the electronic device comprising the resin substrate and the electronic device member.