Heterojunction solar cell and manufacturing method thereof

1. A method for manufacturing a heterojunction solar cell, the method comprising:

Forming a tunnel layer on a semiconductor substrate;

forming a metal compound on the tunnel layer;

forming a transparent conductive oxide on the metal compound;

forming an electrode forming material on the transparent conductive oxide;

sintering the electrode forming material using light sintering to form an electrode part,

wherein the transparent conductive oxide is also sintered by the light sintering to form a transparent conductive oxide layer formed of the transparent conductive oxide,

wherein the transparent conductive oxide layer and the electrode part are simultaneously formed by light sintering the transparent conductive oxide when light sintering the electrode forming material, and

wherein a metal compound layer formed of the metal compound, the transparent conductive oxide layer, and the electrode part are simultaneously formed by light sintering the metal compound when light sintering the transparent conductive oxide and the electrode forming material.

2. The method of claim 1 , wherein the light sintering is carried out by using a xenon flash lamp having an energy (E) of 5 J/cm2 to 500 J/cm2, a pulse width (W) of 0.1 ms to 50 ms, a pulse number (N) of 1 to 100 times, and a pulse gap of 1 ms to 100 ms.

3. The method of claim 1 , wherein the metal compound is formed of any one of metal oxides selected from oxides including transition metals.

4. The method of claim 3 , wherein the metal compound is formed of any one of the binary metal oxides selected from molybdenum oxide, titanium oxide, vanadium oxide, tungsten oxide, zinc oxide, manganese oxide, nickel oxide, and chromium oxide.

5. The method of claim 3 , wherein the transparent conductive oxide is formed of any one material selected from ITO, IWO, IZO, and AZO.

6. The method of claim 3 , wherein the electrode forming material is formed of a conductive paste containing fine metal particles, a binder and a solvent, and the fine metal particles include at least one selected from copper, copper-silver, and copper-nickel.

7. The method of claim 6 , wherein the fine metal particles are formed into micro- or nano-sized particles, and the conductive paste is formed by mixing 50 to 80% by weight, 15 to 40% by weight, and 5 to 40% by weight of the fine metal particles, the binder, and the solvent, respectively, with respect to a total weight of the conductive paste.

8. The method of claim 3 ,

wherein the tunnel layer is formed of intrinsic amorphous silicon or silicon oxide.