MECHANICALLY STRENGTHENED PIEZOELECTRIC SENSOR FOR STRUCTURAL HEALTH MONITORING
The present invention discloses a mechanically strengthened piezoelectric sensor for Structural Health Monitoring applications. The sensor includes a two-sided piezo ceramic component, a sensor encapsulation, and at least two wires. The sensor encapsulation has an indented side that forms a recessed area. The recessed area has a supporting structure. The two-sided piezo ceramic component is mounted into the recessed area of the encapsulation and is supported by the supporting structure with the side facing outwards slightly lower than the upper edge of the recessed area. The supporting structure of the encapsulation provides mechanical strength to the piezo ceramic component. The wires are attached to the electrodes of the piezo ceramic component and extend out of the encapsulation. Alternatively, the mechanically strengthened piezoelectric sensor may further include a Printed Circuit Board (PCB). The piezo ceramic component is mounted on the PCB. Then, the PCB is mounted into the recessed area of the encapsulation and is supported by the supporting structure with the side facing outwards slightly lower than the upper edge of the encapsulation.
1 . A mechanically strengthened piezoelectric sensor for Structural Health Monitoring (SHM), comprising:
a sensor encapsulation having an indented side that forms a recessed area with an upper edge, a supporting structure in the recessed area, a sidewall, a bottom side, and an opening through the sidewall or the bottom side;
a two-sided piezo ceramic component connected to a plurality of electrical wires, wherein the two-sided piezo ceramic component is mounted into the recessed area and supported by the supporting structure with a side facing outwards and slightly lower than the upper edge and the plurality of electrical wires extending outside the sensor encapsulation through the opening.
2 . The mechanically strengthened piezoelectric sensor of claim 1 further comprises a Printed Circuit Board (“PCB”), wherein the two-sided piezo ceramic component is mounted to the PCB, the PCB and the two-sided piezo ceramic component are mounted into the recessed area and supported by the supporting structure, and the two-sided piezo ceramic component is connected to the plurality of electrical wires via the PCB.
3 . The mechanically strengthened piezoelectric sensor of claim 2 , wherein each of said plurality of electrical wires has a protection layer.
4 . The mechanically strengthened piezoelectric sensor of claim 1 , wherein any gap between the two-sided piezo ceramic component and the encapsulation is sealed with glue, epoxy, or waterproof material.
5 . The mechanically strengthened piezoelectric sensor of claim 1 , wherein any gap between the plurality of electrical wires and the encapsulation is sealed with glue, epoxy, or waterproof material.
6 . The mechanically strengthened piezoelectric sensor of claim 1 , wherein said piezo ceramic component has a shape of a circle, a ring, a triangle, a square, a rectangle, or a polygon.
7 . The mechanically strengthened piezoelectric sensor of claim 1 , wherein the encapsulation has a shape of a circle, a ring, a triangle, a square, a rectangle, or a polygon.
8 . The mechanically strengthened piezoelectric sensor of claim 1 , wherein said encapsulation has an extension around the opening for protecting the plurality of electrical wires.
9 . The mechanically strengthened piezoelectric sensor of claim 1 , wherein the supporting structure is manufactured as an integral part of the sensor encapsulation through a molding process.
10 . The mechanically strengthened piezoelectric sensor of claim 1 , wherein the supporting structure is manufactured as a separate component and is assembled with the sensor encapsulation.